Datasheet HMC8401 (Analog Devices) - 9

Data Sheet HMC8401 22 22 +85°C +85°C +25°C +25°C 20 –55°C 20 –55°C 18 18 Bm) 16 16 Bm) d d ( ( B AT 1d 14 S 14 P P 12 12 10 10 8 8 0 5 10 15 20 25 30
016
0 5 10 15 20 25 30
019
FREQUENCY (GHz)
13850-
FREQUENCY (GHz)
13850- Figure 16. P1dB vs. Frequency at Various Temperatures Figure 19. PSAT vs. Frequency at Various Temperatures
22 22 6.5V 7.5V 20 8.5V 20 18 18 Bm) 16 16 d Bm) ( d B ( 1d 14 AT 14 P SP 12 12 10 10 6.5V 7.5V 8.5V 8 8 0 5 10 15 20 25 30
017
0 5 10 15 20 25 30
020
FREQUENCY (GHz)
13850-
FREQUENCY (GHz)
13850- Figure 17. P1dB vs. Frequency at Various Supply Voltages Figure 20. PSAT vs. Frequency at Various Supply Voltages
30 55 +85°C +25°C –55°C 50 26 45 Bm) Bc) d d 40 ( 22 ( IP3 IM3 35 3GHz 7GHz 18 11GHz 17GHz 30 21GHz 25GHz 27GHz 14 25 0 5 10 15 20 25 30
018
0 1 2 3 4 5 6 7 8
021
FREQUENCY (GHz) P
13850-
OUT/TONE (dBm)
13850- Figure 18. Output IP3 vs. Frequency for Various Temperatures at Figure 21. Output Third Order Intermodulation (IM3) vs. POUT/Tone for POUT = 0 dBm/Tone Various Frequencies at VDD = 6.5 V Rev. B | Page 9 of 17 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications 0.01 GHz to 3 GHz Frequency Range 3 GHz to 26 GHz Frequency Range 26 GHz to 28 GHz Frequency Range Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Typical Application Circuit Assembly Diagram Outline Dimensions Ordering Guide