Data Sheet. HMC8410CHIPS. TYPICAL PERFORMANCE CHARACTERISTICS. +85°C. +25°C. –55°C. B) d (. S O. URN L T. N (. , RE. –10. d N (. –15. AI G. –20. S11. –25
Data SheetHMC8410CHIPSTYPICAL PERFORMANCE CHARACTERISTICS2522+85°C20+25°C20–55°C15B) d (10S18S O5B)160dURN L TN (–5AI, RE14GB)–10d N (–1512AI G–20S1110–25S21 S22–30801234567891011 006 01234567891011 009 FREQUENCY (GHz) 15093- FREQUENCY (GHz) 15093- Figure 6. Gain and Return Loss vs. Frequency Figure 9. Gain vs. Frequency for Various Temperatures 00+85°C+85°C–2+25°C+25°C–55°C–55°C–5–4B)B)dd–6((–10SSSSO–8O–15–10URN LURN LTT–12–20REREUTUT–14P–25INPUT–16O–30–18–20–3501234567891011 007 01234567891011 010 FREQUENCY (GHz) 15093- FREQUENCY (GHz) 15093- Figure 7. Input Return Loss vs. Frequency for Various Temperatures Figure 10. Output Return Loss vs. Frequency for Various Temperatures 4.015+85°C+85°C+25°C14+25°C3.5–55°C13–55°C123.011))dB10(2.5dBE( E9RR82.0FIGU7EFIGU E1.56OISOISNN51.0430.52100 1 01234567891011 008 1 00.20.40.60.81.01.21.41.61.82.0 0 FREQUENCY (GHz) 15093- FREQUENCY (GHz) 15093- Figure 8. Noise Figure vs. Frequency for Various Temperatures Figure 11. Noise Figure vs. Frequency for Various Temperatures, 10 MHz to 1 GHz Rev. C | Page 7 of 17 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 0.01 GHz TO 3 GHz FREQUENCY RANGE 3 GHz TO 8 GHz FREQUENCY RANGE 8 GHz TO 10 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE