Datasheet HMC7950 (Analog Devices) - 5

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Data Sheet HMC7950 ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage (VDD) 8 V (PCB) design and operating environment. Careful attention to Second Gate Bias Voltage (VGG2) −2.5 V to +3 V PCB thermal design is required. Radio Frequency Input Power (RFIN) 20 dBm θJC is the junction to case thermal resistance. Channel Temperature 175°C Continuous Power Dissipation (PDISS), 1.55 W
Table 6. Thermal Resistance
TA = 85°C (Derate 17.2 mW/°C Above 85°C)
Package Type θJC Unit
Maximum Peak Reflow Temperature (MSL3)1 260°C EP-16-21 58 °C/W Storage Temperature Range −65°C to +150°C 1 Channel to ground pad. See JEDEC Standard JESD51-2 for additional Operating Temperature Range −40°C to +85°C information on optimizing the thermal impedance ESD Sensitivity, Human Body Model (HBM) 250 V (Class 1A) 1 See the Ordering Guide section for more information.
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS 2 GHz TO 5 GHz FREQUENCY RANGE 5 GHz TO 18 GHz FREQUENCY RANGE 18 GHz TO 28 GHz FREQUENCY RANGE DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION EVALUATION BOARD EVALUATION BOARD SCHEMATIC OUTLINE DIMENSIONS ORDERING GUIDE