Datasheet HMC788A (Analog Devices) - 4
| Hersteller | Analog Devices |
| Beschreibung | 0.01 GHz to 10 GHz, MMIC, GaAs, pHEMT RF Gain Block |
| Seiten / Seite | 12 / 4 — HMC788A. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| Revision | D |
| Dateiformat / Größe | PDF / 292 Kb |
| Dokumentensprache | Englisch |
HMC788A. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Thermal Resistance
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HMC788A Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Collector Bias Voltage (VCC) 7 V (PCB) design and operating environment. Careful attention to RF Input Power (RFIN), VCC = 5 V 20 dBm PCB thermal design is required. Continuous Power Dissipation, PDISS θJC is the junction to case thermal resistance. (TCASE = 85°C, Derate 8.5 mW/°C Above 85°C) 0.76 W Junction (TJ) Temperature 175°C
Table 3. Thermal Resistance
Operating (TOPR) Temperature Range −40°C to +85°C
Package Type θJC Unit
Storage Temperature Range −65°C to +150°C CP-6-101 118.0 °C/W Electrostatic Discharge (ESD) Sensitivity, Class 1A 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal Human Body Model (HBM) test board with nine thermal vias. See JEDEC JESD51. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. D | Page 4 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BASIC CONNECTIONS APPLICATIONS INFORMATION EVALUATION PCB OUTLINE DIMENSIONS ORDERING GUIDE
Thermal performance is directly linked to printed circuit board Collector Bias Voltage (VCC) 7 V (PCB) design and operating environment. Careful attention to RF Input Power (RFIN), VCC = 5 V 20 dBm PCB thermal design is required. Continuous Power Dissipation, PDISS θJC is the junction to case thermal resistance. (TCASE = 85°C, Derate 8.5 mW/°C Above 85°C) 0.76 W Junction (TJ) Temperature 175°C
Table 3. Thermal Resistance
Operating (TOPR) Temperature Range −40°C to +85°C
Package Type θJC Unit
Storage Temperature Range −65°C to +150°C CP-6-101 118.0 °C/W Electrostatic Discharge (ESD) Sensitivity, Class 1A 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal Human Body Model (HBM) test board with nine thermal vias. See JEDEC JESD51. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. D | Page 4 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BASIC CONNECTIONS APPLICATIONS INFORMATION EVALUATION PCB OUTLINE DIMENSIONS ORDERING GUIDE