Datasheet HMC-AUH317 (Analog Devices) - 3
| Hersteller | Analog Devices |
| Beschreibung | GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 81 -86 GHz |
| Seiten / Seite | 6 / 3 — HMC-AUH317. GaAs HEMT MMIC MEDIUM POWER. AMPLIFIER, 81 - 86 GHz. Absolute … |
| Dateiformat / Größe | PDF / 359 Kb |
| Dokumentensprache | Englisch |
HMC-AUH317. GaAs HEMT MMIC MEDIUM POWER. AMPLIFIER, 81 - 86 GHz. Absolute Maximum Ratings. Reliability Information
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Textversion des Dokuments
HMC-AUH317
v04.0511
GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 81 - 86 GHz Absolute Maximum Ratings Reliability Information
nominal 4.0V supply to GnD 0.0V to +4.5V Junction Temperature to maintain 180 °C 1 million hour mTTf Gate Bias Voltage -0.8V to +0.3V 3 nominal Junction Temperature (T = 85 °C) 156.1 °C rf input power (Vdd = +4.0V) +3 dBm Thermal resistance (Junction to Die Bottom) 111.0 °C/w storage Temperature -65 to +150 °C operating Temperature -55 to +85 °C Max Peak Reflow Temperature 260 °C Drain Bias Current (idd1) 100 mA ip Drain Bias Current (idd2) 100 mA h eleCTrosTATiC sensiTiVe DeViCe oBserVe hAnDlinG preCAUTions r - C
Outline Drawing
e w o p r & A e lin s - r ie lif p m A noTes:
Die Packaging Information
[1] 1. All Dimensions Are in inChes [mm]. 2. BACKsiDe meTAlliZATion: GolD. standard Alternate 3. BACKsiDe meTAl is GroUnD. GP-1 (Gel Pack) [2] 4. BonD pAD meTAlliZATion: GolD. 5. ConneCTion noT reQUireD for UnlABeleD BonD pADs. [1] Refer to the “Packaging Information” section for die 6. oVerAll Die siZe ±.002” packaging dimensions. 7. Die ThiCKness is 0.002” [0.050 mm] [2] For alternate packaging information contact Hittite 8 TYpiCAl BonD pAD is 0.004” [0.100 mm] sQUAre Unless noTeD Microwave Corporation. Inf F or o m r at ip on rfic ur e nis, hd e e d lbiy ve An ry alo a g n Ded vi cteos ip s la belciee v eo d rtd o e b r e sa: cc H ur iattte itae n d M rel iic a r bl o e. w H a o v we e ve rC , noo For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rporation, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
3 - 3
Phone: 978-250-3343 Fax: 978-250-3373 rights of third parties that may result from its use. Specifications subject to change without notice. No O Ph rod n e e r : 7On 81- - 3 li 2 n 9-e 4 a 70t ww 0 • O w rd . e hi r ott nliite n .c e a o t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 pli co atri o ap n S p ups@ por h t it : Ptit hoen.c e o : 1 m -800-ANALOG-D
v04.0511
GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 81 - 86 GHz Absolute Maximum Ratings Reliability Information
nominal 4.0V supply to GnD 0.0V to +4.5V Junction Temperature to maintain 180 °C 1 million hour mTTf Gate Bias Voltage -0.8V to +0.3V 3 nominal Junction Temperature (T = 85 °C) 156.1 °C rf input power (Vdd = +4.0V) +3 dBm Thermal resistance (Junction to Die Bottom) 111.0 °C/w storage Temperature -65 to +150 °C operating Temperature -55 to +85 °C Max Peak Reflow Temperature 260 °C Drain Bias Current (idd1) 100 mA ip Drain Bias Current (idd2) 100 mA h eleCTrosTATiC sensiTiVe DeViCe oBserVe hAnDlinG preCAUTions r - C
Outline Drawing
e w o p r & A e lin s - r ie lif p m A noTes:
Die Packaging Information
[1] 1. All Dimensions Are in inChes [mm]. 2. BACKsiDe meTAlliZATion: GolD. standard Alternate 3. BACKsiDe meTAl is GroUnD. GP-1 (Gel Pack) [2] 4. BonD pAD meTAlliZATion: GolD. 5. ConneCTion noT reQUireD for UnlABeleD BonD pADs. [1] Refer to the “Packaging Information” section for die 6. oVerAll Die siZe ±.002” packaging dimensions. 7. Die ThiCKness is 0.002” [0.050 mm] [2] For alternate packaging information contact Hittite 8 TYpiCAl BonD pAD is 0.004” [0.100 mm] sQUAre Unless noTeD Microwave Corporation. Inf F or o m r at ip on rfic ur e nis, hd e e d lbiy ve An ry alo a g n Ded vi cteos ip s la belciee v eo d rtd o e b r e sa: cc H ur iattte itae n d M rel iic a r bl o e. w H a o v we e ve rC , noo For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rporation, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
3 - 3
Phone: 978-250-3343 Fax: 978-250-3373 rights of third parties that may result from its use. Specifications subject to change without notice. No O Ph rod n e e r : 7On 81- - 3 li 2 n 9-e 4 a 70t ww 0 • O w rd . e hi r ott nliite n .c e a o t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 pli co atri o ap n S p ups@ por h t it : Ptit hoen.c e o : 1 m -800-ANALOG-D