Datasheet ADL5320 (Analog Devices) - 5

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Data Sheet ADL5320 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
Table 4 lists the junction-to-air thermal resistance (θJA) and the Supply Voltage, VSUP 6.5 V junction-to-paddle thermal resistance (θJC) for the ADL5320. Input Power (50 Ω Impedance) 20 dBm
Table 4. Thermal Resistance
Internal Power Dissipation (Paddle Soldered) 683 mW
Package Type θ 1 2 JA θJC Unit
Maximum Junction Temperature 150°C 3-Lead SOT-89 35 11 °C/W Operating Temperature Range −40°C to +105°C Storage Temperature Range −65°C to +150°C 1 Measured on Analog Devices, Inc., evaluation board. For more information about board layout, see the Soldering Information and Recommended PCB Stresses above those listed under Absolute Maximum Ratings Land Pattern section. 2 Based on simulation with JEDEC standard JESD51. may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
ESD CAUTION
other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B | Page 5 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure Optimizing OP1dB W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide