Datasheet ADL5321 (Analog Devices) - 9
| Hersteller | Analog Devices |
| Beschreibung | 2.3 GHz TO 4.0 GHz ¼ Watt RF Driver Amplifier |
| Seiten / Seite | 16 / 9 — Data Sheet. ADL5321. RCE. 3.76 3.80 3.84 3.88 3.92 3.96 4.00 4.04 4.08 … |
| Revision | D |
| Dateiformat / Größe | PDF / 464 Kb |
| Dokumentensprache | Englisch |
Data Sheet. ADL5321. RCE. 3.76 3.80 3.84 3.88 3.92 3.96 4.00 4.04 4.08 4.12 4.16. 39. 40. 41. 42. OIP3 (dBM). NF (dB). 110. 105. 100. 5.25V. mA) (
Modelllinie für dieses Datenblatt
Textversion des Dokuments
Data Sheet ADL5321 30 30 25 25 %) %) ( 20 ( 20 E E AG AG NT 15 NT 15 RCE RCE E E P P 10 10 5 5 0 0 4 6 8 0 2 4 6 8 0 2 4 6 8 0 2 4 6 3.76 3.80 3.84 3.88 3.92 3.96 4.00 4.04 4.08 4.12 4.16
015
39. 39. 39. 40. 40. 40. 40. 40. 41. 41. 41. 41. 41. 42. 42. 42. 42.
018
OIP3 (dBM) NF (dB)
07307- 07307- Figure 16. OIP3 Distribution at 2.6 GHz Figure 19. Noise Figure (NF) Distribution at 2.6 GHz
35 110 30 105 25 %) 100 ( 5.25V E mA) ( AG 20 95 NT NT 90 RCE 15 5.0V E CURRE P Y L 85 P 10 UP S 4.75V 80 5 75 0
019
6 8 0 2 4 6 8 0 2 4 6 8 0 70
016
24. 24. 25. 25. 25. 25. 25. 26. 26. 26. 26. 26. 27.
07307-
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 P1dB (dBM) TEMPERATURE (°C)
07307- Figure 17. P1dB Distribution at 2.6 GHz Figure 20. Supply Current vs. Temperature and Supply Voltage (Using 2.6 GHz Matching Components)
35 220 200 30 180 25 160 %) mA) ( ( E NT 140 AG 20 NT 120 RCE 15 CUURE E Y 100 P L 5V P 80 10 UP S 60 5 3.3V 40 0 20 70 75 80 85 90 95 00 05 10 15 20 25 –6 –4 –2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
120 017
13. 13. 13. 13. 13. 13. 14. 14. 14. 14. 14. 14. POUT (dBm)
07307- 07307-
GAIN (dB)
Figure 18. Gain Distribution at 2.6 GHz Figure 21. Supply Current vs. POUT 3.3 V and 5 V (2.6 GHz Matching Components) Rev. D | Page 9 of 16 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure WiMax Operation Evaluation Board Outline Dimensions Ordering Guide
015
39. 39. 39. 40. 40. 40. 40. 40. 41. 41. 41. 41. 41. 42. 42. 42. 42.
018
OIP3 (dBM) NF (dB)
07307- 07307- Figure 16. OIP3 Distribution at 2.6 GHz Figure 19. Noise Figure (NF) Distribution at 2.6 GHz
35 110 30 105 25 %) 100 ( 5.25V E mA) ( AG 20 95 NT NT 90 RCE 15 5.0V E CURRE P Y L 85 P 10 UP S 4.75V 80 5 75 0
019
6 8 0 2 4 6 8 0 2 4 6 8 0 70
016
24. 24. 25. 25. 25. 25. 25. 26. 26. 26. 26. 26. 27.
07307-
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 P1dB (dBM) TEMPERATURE (°C)
07307- Figure 17. P1dB Distribution at 2.6 GHz Figure 20. Supply Current vs. Temperature and Supply Voltage (Using 2.6 GHz Matching Components)
35 220 200 30 180 25 160 %) mA) ( ( E NT 140 AG 20 NT 120 RCE 15 CUURE E Y 100 P L 5V P 80 10 UP S 60 5 3.3V 40 0 20 70 75 80 85 90 95 00 05 10 15 20 25 –6 –4 –2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
120 017
13. 13. 13. 13. 13. 13. 14. 14. 14. 14. 14. 14. POUT (dBm)
07307- 07307-
GAIN (dB)
Figure 18. Gain Distribution at 2.6 GHz Figure 21. Supply Current vs. POUT 3.3 V and 5 V (2.6 GHz Matching Components) Rev. D | Page 9 of 16 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure WiMax Operation Evaluation Board Outline Dimensions Ordering Guide