Datasheet HMC789ST89E (Analog Devices) - 9
| Hersteller | Analog Devices |
| Beschreibung | InGaP HBT GAIN BLOCK MMIC AMPLIFIER, 0.7 -2.8 GHz |
| Seiten / Seite | 16 / 9 — HMC789ST89E. InGaP HBT GAIN BLOCK MMIC. AMPLIFIER, 0.7 -2.8 GHz. Absolute … |
| Dateiformat / Größe | PDF / 716 Kb |
| Dokumentensprache | Englisch |
HMC789ST89E. InGaP HBT GAIN BLOCK MMIC. AMPLIFIER, 0.7 -2.8 GHz. Absolute Maximum Ratings. Outline Drawing. Package Information
Modelllinie für dieses Datenblatt
Textversion des Dokuments
HMC789ST89E
v02.0314
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, 0.7 -2.8 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +6.0 V T RF Input Power (RFIN)(Vs +5Vdc) +18 dBm M Junction Temperature 150 °C Continuous Pdiss (T = 85 °C) 0.85 W (derate 13.0 mW/°C above 85 °C) K - S Thermal Resistance 77 °C/W (junction to ground paddle) C Storage Temperature -65 to +150 °C LO Operating Temperature -40 to +85 °C IN B ELECTROSTATIC SENSITIVE DEVICE A OBSERVE HANDLING PRECAUTIONS
Outline Drawing
R & G E IV R S - D R IE LIF NOTES: P 1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-180S OR EQUIVALENT. M 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. A 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [1] HMC789ST89E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H789 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C I F nf o or r p mati r o in cfe ur , d nish e e l d iv b e y r A y a nalo n g d t Devi o p ces i la s c bele o ieve rd d t e o rbs e : H acc iutrtatite e M and ic reli rao bl w e. a H v o e C wever o , nrp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Phoe n r O e: 7 n- 81-li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o it nle i . n co e a m
9
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 o pplic r a atio pp n S s u @ p h por ittti : Pte ho.c n o e m : 1-800-ANALOG-D
v02.0314
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, 0.7 -2.8 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +6.0 V T RF Input Power (RFIN)(Vs +5Vdc) +18 dBm M Junction Temperature 150 °C Continuous Pdiss (T = 85 °C) 0.85 W (derate 13.0 mW/°C above 85 °C) K - S Thermal Resistance 77 °C/W (junction to ground paddle) C Storage Temperature -65 to +150 °C LO Operating Temperature -40 to +85 °C IN B ELECTROSTATIC SENSITIVE DEVICE A OBSERVE HANDLING PRECAUTIONS
Outline Drawing
R & G E IV R S - D R IE LIF NOTES: P 1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-180S OR EQUIVALENT. M 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. A 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [1] HMC789ST89E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H789 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C I F nf o or r p mati r o in cfe ur , d nish e e l d iv b e y r A y a nalo n g d t Devi o p ces i la s c bele o ieve rd d t e o rbs e : H acc iutrtatite e M and ic reli rao bl w e. a H v o e C wever o , nrp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Phoe n r O e: 7 n- 81-li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o it nle i . n co e a m
9
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 o pplic r a atio pp n S s u @ p h por ittti : Pte ho.c n o e m : 1-800-ANALOG-D