Datasheet ADL5324 (Analog Devices) - 7
| Hersteller | Analog Devices |
| Beschreibung | 400 MHz TO 4000 MHz ½ Watt RF Driver Amplifier |
| Seiten / Seite | 20 / 7 — Data Sheet. ADL5324. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. RFIN 1. … |
| Revision | B |
| Dateiformat / Größe | PDF / 553 Kb |
| Dokumentensprache | Englisch |
Data Sheet. ADL5324. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. RFIN 1. GND 2. TOP VIEW. (2) GND. (Not to Scale). RFOUT 3
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Data Sheet ADL5324 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS RFIN 1 ADL5324 GND 2 TOP VIEW (2) GND (Not to Scale)
002
RFOUT 3
10562- Figure 3. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 RFIN RF Input. This pin requires a dc blocking capacitor. 2 GND Ground. Connect this pin to a low impedance ground plane. Note that the paddle, which is exposed, encompasses Pin 2 and the tab at the top side of the package. It should be soldered to a low impedance ground plane for electrical grounding and thermal transfer. 3 RFOUT RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the external power supply. The RF path requires a dc blocking capacitor. Rev. B | Page 7 of 20 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide
002
RFOUT 3
10562- Figure 3. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 RFIN RF Input. This pin requires a dc blocking capacitor. 2 GND Ground. Connect this pin to a low impedance ground plane. Note that the paddle, which is exposed, encompasses Pin 2 and the tab at the top side of the package. It should be soldered to a low impedance ground plane for electrical grounding and thermal transfer. 3 RFOUT RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the external power supply. The RF path requires a dc blocking capacitor. Rev. B | Page 7 of 20 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide