Datasheet AOZ1374DI (Alpha & Omega) - 2
| Hersteller | Alpha & Omega |
| Beschreibung | ECPower 23 V 36 mΩ Protection Switch Programmable Current Limit and True Reverse Current Blocking |
| Seiten / Seite | 18 / 2 — ALPHA & OMEGA. AOZ1374DI. Ordering Information. Part Number. Fault … |
| Dateiformat / Größe | PDF / 1.7 Mb |
| Dokumentensprache | Englisch |
ALPHA & OMEGA. AOZ1374DI. Ordering Information. Part Number. Fault Recovery. Junction Temperature Range. Package. Environmental
Modelllinie für dieses Datenblatt
Textversion des Dokuments
ALPHA & OMEGA
S E M I C O N D U C T O R
AOZ1374DI Ordering Information Part Number Fault Recovery Junction Temperature Range Package Environmental
AOZ1374DI-01 Auto-Recovery -40°C to + 125 °C DFN3x3-10L RoHS AOZ1374DI-02 Latch-Off -40°C to + 125 °C DFN3x3-10L RoHS AOS products are offered in packages with Pb-free plating and compliant to RoHS standards. Please visit www.aosmd.com/media/AOSGreenPolicy.pdf for additional information.
Pin Configuration
VIN 1 10 VOUT 2 VIN 9 VOUT EXP SS 3 8 FLTB EN 4 7 POVP ILIM 5 6 GND
DFN3x3-10L (Top Transparent View) Pin Description Pin Number Pin Name Pin Function
1, 2 VIN Supply input. Connected to internal power regulator. They are internally connected together. 3 SS Soft Start control. Connect a capacitor CSS from SS to GND to set the soft start time. 4 EN Enable input. Active high. 5 ILIM Current limit set pin. Connect a 1% resistor RLIM from ILIM to GND to set the current limit threshold. 6 GND Ground 7 POVP Programmable Over Voltage Protection. Use resistor divider from VIN to GND to set the OVP threshold. 8 FLTB Open-drain Fault indicator. 9, 10 VOUT Power output. Connect to Type C port. They are internally connected together. Exposed Thermal Pad. It must be connected to GND plane for optimal thermal dissipation. Solder EXP EXP to a metal surface directly underneath the EXP and connect to PCB ground on multiple layers through VIAs for multi-layer PCB design. For best thermal performance make the ground copper pads as large as possible and connect to EXP with multiple VIAs. Rev. 1.0 December 2020
www.aosmd.com
Page 2 of 18
S E M I C O N D U C T O R
AOZ1374DI Ordering Information Part Number Fault Recovery Junction Temperature Range Package Environmental
AOZ1374DI-01 Auto-Recovery -40°C to + 125 °C DFN3x3-10L RoHS AOZ1374DI-02 Latch-Off -40°C to + 125 °C DFN3x3-10L RoHS AOS products are offered in packages with Pb-free plating and compliant to RoHS standards. Please visit www.aosmd.com/media/AOSGreenPolicy.pdf for additional information.
Pin Configuration
VIN 1 10 VOUT 2 VIN 9 VOUT EXP SS 3 8 FLTB EN 4 7 POVP ILIM 5 6 GND
DFN3x3-10L (Top Transparent View) Pin Description Pin Number Pin Name Pin Function
1, 2 VIN Supply input. Connected to internal power regulator. They are internally connected together. 3 SS Soft Start control. Connect a capacitor CSS from SS to GND to set the soft start time. 4 EN Enable input. Active high. 5 ILIM Current limit set pin. Connect a 1% resistor RLIM from ILIM to GND to set the current limit threshold. 6 GND Ground 7 POVP Programmable Over Voltage Protection. Use resistor divider from VIN to GND to set the OVP threshold. 8 FLTB Open-drain Fault indicator. 9, 10 VOUT Power output. Connect to Type C port. They are internally connected together. Exposed Thermal Pad. It must be connected to GND plane for optimal thermal dissipation. Solder EXP EXP to a metal surface directly underneath the EXP and connect to PCB ground on multiple layers through VIAs for multi-layer PCB design. For best thermal performance make the ground copper pads as large as possible and connect to EXP with multiple VIAs. Rev. 1.0 December 2020
www.aosmd.com
Page 2 of 18