Datasheet LT8645S-2 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | 65V, 8A Synchronous Step-Down Silent Switcher with 2.5µA Quiescent Current |
| Seiten / Seite | 30 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). TOP VIEW. ORDER … |
| Revision | A |
| Dateiformat / Größe | PDF / 3.3 Mb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). TOP VIEW. ORDER INFORMATION. MSL. PART NUMBER. PART MARKING*. FINISH CODE
Modelllinie für dieses Datenblatt
Textversion des Dokuments
LT8645S-2
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VIN, EN/UV ..65V
TOP VIEW
PG ...42V BIAS ..25V FB PG GND TR/SS SYNC/MODE CLKOUT FB, TR/SS . ...4V 32 31 30 29 28 27 SYNC/MODE Voltage . ..6V BIAS 1 26 RT INTV EN/UV Operating Junction Temperature Range (Note 2) 2 25 CC 33 34 NC 3 GND GND 24 NC LT8645S-2E ... –40°C to 125°C V 4 23 IN VIN LT8645S-2J ... –40°C to 150°C V 5 22 IN VIN 35 36 LT8645S-2H .. –40°C to 150°C V 6 GND GND 21 IN VIN Storage Temperature Range .. –65°C to 150°C NC 7 20 NC Maximum Reflow (Package Body) Temperature ...260°C GND 8 19 GND 37 38 GND 9 GND GND 18 GND GND 10 17 GND 11 12 13 14 15 16 BST SW SW SW SW SW LQFN PACKAGE 32-LEAD (6mm × 4mm × 0.94mm) JEDEC BOARD: θJA = 30°C/W, ΨJT = 0.6°C/W, θJCTOP = 28.5°C/W, θJC(PAD) = 4.4°C/W (NOTE 3) DEMO BOARD: θJA = 17°C/W EXPOSED PADS (PINS 33-38) ARE GND, SHOULD BE SOLDERED TO PCB
ORDER INFORMATION MSL PART NUMBER PART MARKING* FINISH CODE PAD FINISH PACKAGE TYPE** RATING TEMPERATURE RANGE
LT8645SEV-2#PBF –40°C to 125°C LT8645SJV-2#PBF 86452 e4 Au (RoHS) LQFN (Laminate Package with QFN Footprint) 3 –40°C to 150°C LT8645SHV-2#PBF
AUTOMOTIVE PRODUCTS***
LT8645SEV-2#WPBF –40°C to 125°C LT8645SJV-2#WPBF 86452 e4 Au (RoHS) LQFN (Laminate Package with QFN Footprint) 3 –40°C to 150°C LT8645SHV-2#WPBF • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Parts ending with PBF are RoHS and WEEE compliant. **The LT8645S-2 package has the same footprint as a standard 6mm × 4mm QFN Package.
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Versions of this part are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. These models are designated with a #W suffix. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models. Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Applications Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VIN, EN/UV ..65V
TOP VIEW
PG ...42V BIAS ..25V FB PG GND TR/SS SYNC/MODE CLKOUT FB, TR/SS . ...4V 32 31 30 29 28 27 SYNC/MODE Voltage . ..6V BIAS 1 26 RT INTV EN/UV Operating Junction Temperature Range (Note 2) 2 25 CC 33 34 NC 3 GND GND 24 NC LT8645S-2E ... –40°C to 125°C V 4 23 IN VIN LT8645S-2J ... –40°C to 150°C V 5 22 IN VIN 35 36 LT8645S-2H .. –40°C to 150°C V 6 GND GND 21 IN VIN Storage Temperature Range .. –65°C to 150°C NC 7 20 NC Maximum Reflow (Package Body) Temperature ...260°C GND 8 19 GND 37 38 GND 9 GND GND 18 GND GND 10 17 GND 11 12 13 14 15 16 BST SW SW SW SW SW LQFN PACKAGE 32-LEAD (6mm × 4mm × 0.94mm) JEDEC BOARD: θJA = 30°C/W, ΨJT = 0.6°C/W, θJCTOP = 28.5°C/W, θJC(PAD) = 4.4°C/W (NOTE 3) DEMO BOARD: θJA = 17°C/W EXPOSED PADS (PINS 33-38) ARE GND, SHOULD BE SOLDERED TO PCB
ORDER INFORMATION MSL PART NUMBER PART MARKING* FINISH CODE PAD FINISH PACKAGE TYPE** RATING TEMPERATURE RANGE
LT8645SEV-2#PBF –40°C to 125°C LT8645SJV-2#PBF 86452 e4 Au (RoHS) LQFN (Laminate Package with QFN Footprint) 3 –40°C to 150°C LT8645SHV-2#PBF
AUTOMOTIVE PRODUCTS***
LT8645SEV-2#WPBF –40°C to 125°C LT8645SJV-2#WPBF 86452 e4 Au (RoHS) LQFN (Laminate Package with QFN Footprint) 3 –40°C to 150°C LT8645SHV-2#WPBF • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Parts ending with PBF are RoHS and WEEE compliant. **The LT8645S-2 package has the same footprint as a standard 6mm × 4mm QFN Package.
***
Versions of this part are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. These models are designated with a #W suffix. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models. Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Applications Related Parts