Datasheet PUSB3BB2DF (Nexperia) - 9

Nexperia PESD5V0C2BDF Extremely low clamping low capacitance ESD protection 12. Soldering Footprint information for reflow soldering of ultra smal and leadless encapsulated package; 3 terminals SOT8013
0.95 0.145 0.135 0.1 0.135 0.145 0.68 0.33 0.48 R 0.03 0.12 0.15 0.12 0.15 0.12 0.85 recommended stencil thickness: 0.08 mm occupied area solder resist solder land stencil opening (Cu extends under solder resist) Dimensions in mm Issue date 19-10-29 sot8013_fr 20-02-26
Fig. 13. Reflow soldering footprint for DFN0603-3 (SOT8013)
PESD5V0C2BDF All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. Al rights reserved
Product data sheet 23 July 2020 9 / 12
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Characteristics 10. Application information 11. Package outline 12. Soldering 13. Revision history 14. Legal information Contents