Datasheet BAT46WJ (Nexperia) - 6

HerstellerNexperia
BeschreibungSchottky barrier diode
Seiten / Seite12 / 6 — Nexperia. BAT46WJ. Single Schottky barrier diode. Fig 6. Average reverse …
Revision02062017
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DokumentenspracheEnglisch

Nexperia. BAT46WJ. Single Schottky barrier diode. Fig 6. Average reverse power dissipation as a. Fig 7

Nexperia BAT46WJ Single Schottky barrier diode Fig 6 Average reverse power dissipation as a Fig 7

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Nexperia BAT46WJ Single Schottky barrier diode
006aac390 006aac391 0.25 0.3 PR(AV) (W) I (1) F(AV) 0.20 (A) 0.2 (2) 0.15 (1) (2) 0.10 (3) (3) 0.1 (4) 0.05 (4) 0.0 0.0 0 20 40 60 80 100 0 25 50 75 100 125 150 175 VR (V) Tamb (°C) Tj = 125 C FR4 PCB, standard footprint (1)  = 1 Tj = 150 C (2)  = 0.9 (1)  = 1; DC (3)  = 0.8 (2)  = 0.5; f = 20 kHz (4)  = 0.5 (3)  = 0.2; f = 20 kHz (4)  = 0.1; f = 20 kHz
Fig 6. Average reverse power dissipation as a Fig 7. Average forward current as a function of function of reverse voltage; typical values ambient temperature; typical values
006aac392 006aac393 0.3 0.3 I (1) (1) F(AV) IF(AV) (A) (A) 0.2 0.2 (2) (2) (3) (3) 0.1 0.1 (4) (4) 0.0 0.0 0 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175 Tamb (°C) Tsp (°C) FR4 PCB, mounting pad for cathode 1 cm2 Tj = 150 C Tj = 150 C (1)  = 1; DC (1)  = 1; DC (2)  = 0.5; f = 20 kHz (2)  = 0.5; f = 20 kHz (3)  = 0.2; f = 20 kHz (3)  = 0.2; f = 20 kHz (4)  = 0.1; f = 20 kHz (4)  = 0.1; f = 20 kHz
Fig 8. Average forward current as a function of Fig 9. Average forward current as a function of ambient temperature; typical values solder point temperature; typical values
BAT46WJ All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet Rev. 2 — 8 November 2011 6 of 12
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents