Datasheet PIC16F84A (Microchip) - 6

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PIC16F84A 2.2 Data Memory Organization FIGURE 2-2: REGISTER FILE MAP - PIC16F84A
The data memory is partitioned into two areas. The first is the Special Function Registers (SFR) area, while the File Address File Address second is the General Purpose Registers (GPR) area. 00h Indirect addr.
(1)
Indirect addr.
(1)
80h The SFRs control the operation of the device. 01h TMR0 OPTION_REG 81h Portions of data memory are banked. This is for both the SFR area and the GPR area. The GPR area is 02h PCL PCL 82h banked to allow greater than 116 bytes of general 03h STATUS STATUS 83h purpose RAM. The banked areas of the SFR are for the 04h FSR FSR 84h registers that control the peripheral functions. Banking requires the use of control bits for bank selection. 05h PORTA TRISA 85h These control bits are located in the STATUS Register. 06h PORTB TRISB 86h Figure 2-2 shows the data memory map organization. 07h — — 87h Instructions MOVWF and MOVF can move values from 08h EEDATA EECON1 88h the W register to any location in the register file (“F”), 09h EEADR EECON2
(1)
89h and vice-versa. 0Ah PCLATH PCLATH 8Ah The entire data memory can be accessed either directly using the absolute address of each register file 0Bh INTCON INTCON 8Bh or indirectly through the File Select Register (FSR) 0Ch 8Ch (Section 2.5). Indirect addressing uses the present value of the RP0 bit for access into the banked areas of data memory. 68 General Mapped Data memory is partitioned into two banks which Purpose (accesses) contain the general purpose registers and the special Registers in Bank 0 (SRAM) function registers. Bank 0 is selected by clearing the RP0 bit (STATUS<5>). Setting the RP0 bit selects Bank 1. Each Bank extends up to 7Fh (128 bytes). The first twelve locations of each Bank are reserved for the Special Function Registers. The remainder are Gen- eral Purpose Registers, implemented as static RAM. 4Fh CFh 50h D0h 2.2.1 GENERAL PURPOSE REGISTER FILE Each General Purpose Register (GPR) is 8-bits wide and is accessed either directly or indirectly through the FSR (Section 2.5). 7Fh FFh The GPR addresses in Bank 1 are mapped to Bank 0 Bank 1 addresses in Bank 0. As an example, addressing loca- Unimplemented data memory location, read as '0'. tion 0Ch or 8Ch will access the same GPR.
Note 1:
Not a physical register. DS35007C-page 6  2001-2013 Microchip Technology Inc. Document Outline 1.0 Device Overview FIGURE 1-1: PIC16F84A Block Diagram TABLE 1-1: PIC16F84A Pinout Description 2.0 Memory Organization 2.1 Program Memory Organization FIGURE 2-1: Program Memory Map and Stack - PIC16F84A 2.2 Data Memory Organization 2.2.1 General purpose Register File FIGURE 2-2: Register File Map - PIC16F84A 2.3 Special Function Registers TABLE 2-1: Special Function Register File Summary 2.3.1 STATUS Register Register 2-1: Status Register (Address 03h, 83h) 2.3.2 OPTION Register Register 2-2: OPTION Register (Address 81h) 2.3.3 INTCOn Register Register 2-3: INTCON Register (Address 0Bh, 8Bh) 2.4 PCL and PCLATH 2.4.1 Stack 2.5 Indirect Addressing; INDF and FSR Registers EXAMPLE 2-1: Indirect Addressing EXAMPLE 2-2: How to Clear RAM Using Indirect Addressing FIGURE 2-3: Direct/Indirect Addressing 3.0 Data EEPROM Memory Register 3-1: EECON1 Register (Address 88h) 3.1 Reading the EEPROM Data Memory EXAMPLE 3-1: Data EEPROM Read 3.2 Writing to the EEPROM Data Memory EXAMPLE 3-2: Data EEPROM Write 3.3 Write Verify EXAMPLE 3-3: Write Verify TABLE 3-1: Registers/Bits Associated with Data EEPROM 4.0 I/O Ports 4.1 PORTA and TRISA Registers EXAMPLE 4-1: Initializing PORTA FIGURE 4-1: Block Diagram of Pins RA3:RA0 FIGURE 4-2: Block Diagram of Pin RA4 TABLE 4-1: PORTA Functions TABLE 4-2: Summary of Registers Associated With PORTA 4.2 PORTB and TRISB Registers EXAMPLE 4-2: Initializing PORTB FIGURE 4-3: Block Diagram of Pins RB7:RB4 FIGURE 4-4: Block Diagram of Pins RB3:RB0 TABLE 4-3: PORTB Functions TABLE 4-4: Summary of Registers Associated With PORTB 5.0 Timer0 Module 5.1 Timer0 Operation 5.2 Prescaler FIGURE 5-1: Timer0 Block Diagram 5.2.1 Switching Prescaler ASSIGnment 5.3 Timer0 Interrupt FIGURE 5-2: Block Diagram of the Timer0/WDT Prescaler TABLE 5-1: Registers Associated with Timer0 6.0 Special Features of the CPU 6.1 Configuration Bits Register 6-1: PIC16F84A Configuration Word 6.2 Oscillator Configurations 6.2.1 Oscillator Types 6.2.2 Crystal Oscillator/CERAmic Resonators FIGURE 6-1: Crystal/Ceramic Resonator Operation (HS, XT or LP OSC Configuration) FIGURE 6-2: External Clock Input Operation (HS, XT or LP OSC Configuration) TABLE 6-1: Capacitor Selection for Ceramic Resonators TABLE 6-2: Capacitor Selection for Crystal Oscillator 6.2.3 RC Oscillator FIGURE 6-3: RC Oscillator Mode 6.3 Reset FIGURE 6-4: Simplified Block Diagram of On-Chip Reset Circuit TABLE 6-3: Reset Condition for Program Counter and the STATUS Register TABLE 6-4: Reset Conditions for All Registers 6.4 Power-on Reset (POR) 6.5 Power-up Timer (PWRT) 6.6 Oscillator Start-up Timer (OST) FIGURE 6-5: External Power-on Reset Circuit (For Slow Vdd Power-up) FIGURE 6-6: Time-out Sequence on Power-up (MCLR not Tied to Vdd): Case 1 FIGURE 6-7: Time-out Sequence on Power-up (MCLR Not Tied To Vdd): Case 2 FIGURE 6-8: Time-out Sequence on Power-up (MCLR Tied to Vdd): Fast Vdd Rise Time FIGURE 6-9: Time-Out Sequence on Power-Up (MCLR Tied to Vdd): Slow Vdd Rise Time 6.7 Time-out Sequence and Power-down Status Bits (TO/PD) TABLE 6-5: Time-out in Various Situations TABLE 6-6: STATUS bits and Their Significance 6.8 Interrupts FIGURE 6-10: Interrupt Logic 6.8.1 INT Interrupt 6.8.2 TMR0 Interrupt 6.8.3 PORTB Interrupt 6.8.4 Data EEPROM Interrupt 6.9 Context Saving During Interrupts EXAMPLE 6-1: Saving STATUS and W Registers in RAM 6.10 Watchdog Timer (WDT) 6.10.1 WDT Period 6.10.2 WDT Programming Considerations FIGURE 6-11: Watchdog Timer Block Diagram TABLE 6-7: Summary of Registers Associated With the Watchdog Timer 6.11 Power-down Mode (SLEEP) 6.11.1 SLEEP 6.11.2 Wake-up from SLEEP FIGURE 6-12: Wake-up From Sleep Through Interrupt 6.11.3 Wake-Up Using Interrupts 6.12 Program Verification/Code Protection 6.13 ID Locations 6.14 In-Circuit Serial Programming 7.0 Instruction Set Summary TABLE 7-1: Opcode Field Descriptions FIGURE 7-1: General Format for Instructions TABLE 7-2: PIC16CXXX Instruction Set 7.1 Instruction Descriptions 8.0 Development Support 9.0 Electrical Characteristics FIGURE 9-1: PIC16F84A-20 Voltage-Frequency Graph FIGURE 9-2: PIC16LF84A-04 Voltage- Frequency Graph FIGURE 9-3: PIC16F84A-04 Voltage- Frequency Graph 9.1 DC Characteristics 9.2 DC Characteristics: PIC16F84A-04 (Commercial, Industrial) PIC16F84A-20 (Commercial, Industrial) PIC16LF84A-04 (Commercial, Industrial) 9.3 AC (Timing) Characteristics 9.3.1 Timing Parameter Symbology 9.3.2 Timing Conditions TABLE 9-1: Temperature and Voltage Specifications - AC FIGURE 9-4: Parameter Measurement Information FIGURE 9-5: Load Conditions 9.3.3 Timing Diagrams and Specifications FIGURE 9-6: External Clock Timing TABLE 9-2: External Clock Timing Requirements FIGURE 9-7: CLKOUT and I/O Timing TABLE 9-3: CLKOUT and I/O Timing Requirements FIGURE 9-8: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing TABLE 9-4: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Requirements FIGURE 9-9: Timer0 Clock Timings TABLE 9-5: Timer0 Clock Requirements 10.0 DC/AC Characteristic Graphs FIGURE 10-1: Typical Idd vs. Fosc OVER Vdd (HS Mode, 25°C) FIGURE 10-2: Maximum Idd vs. Fosc OVER Vdd (HS Mode, -40° to +125°C) FIGURE 10-3: Typical Idd vs. Fosc OVER Vdd (XT Mode, 25°C) FIGURE 10-4: Maximum Idd vs. Fosc OVER Vdd (XT Mode, -40° to +125°C) FIGURE 10-5: Typical Idd vs. Fosc OVER Vdd (LP Mode, 25°C) FIGURE 10-6: Maximum Idd vs. Fosc OVER Vdd (LP Mode, -40° to +125°C) FIGURE 10-7: Average Fosc vs. Vdd for R (RC Mode, C = 22 pF, 25°C) FIGURE 10-8: Average Fosc vs. Vdd for R (RC Mode, C = 100 pF, 25°C) FIGURE 10-9: Average Fosc vs. Vdd for R (RC Mode, C = 300 pF, 25°C) FIGURE 10-10: Ipd vs. Vdd (Sleep Mode, all peripherals disabled) FIGURE 10-11: Ipd vs. Vdd (WDT Mode) FIGURE 10-12: Typical, Minimum, and Maximum WDT Period vs. Vdd over Temp FIGURE 10-13: Typical, Minimum and Maximum Voh vs. Ioh (Vdd = 5V, -40°C to +125°C) FIGURE 10-14: Typical, Minimum and Maximum Voh vs. Ioh (Vdd = 3V, -40°C to +125°C) FIGURE 10-15: Typical, Minimum and Maximum Vol vs. Iol (Vdd = 5V, -40°C to +125°C) FIGURE 10-16: Typical, Minimum and Maximum Vol vs. Iol (Vdd = 3V, -40°C to +125°C) FIGURE 10-17: Minimum and Maximum Vin vs. Vdd, (TTL Input, -40°C to +125°C) FIGURE 10-18: Minimum and Maximum Vin vs. Vdd (ST Input, -40°C to +125°C) 11.0 Packaging Information 11.1 Package Marking Information Appendix A: Revision History Appendix B: Conversion Considerations Appendix C: Migration from Baseline to Mid-range Devices A B C D E F I M O P R S T W Z The Microchip Web Site Customer Change Notification Service Customer Support Reader Response Corporate Office Atlanta Boston Chicago Cleveland Fax: 216-447-0643 Dallas Detroit Indianapolis Toronto Fax: 852-2401-3431 Australia - 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