Datasheet ADA4800 (Analog Devices) - 4
| Hersteller | Analog Devices |
| Beschreibung | Low Power, High Speed CCD Buffer Amplifier |
| Seiten / Seite | 16 / 4 — ADA4800. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter … |
| Revision | A |
| Dateiformat / Größe | PDF / 220 Kb |
| Dokumentensprache | Englisch |
ADA4800. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter Rating. Table 3. Thermal Resistance. Package Type. θJA Unit
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ADA4800 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE
TA = 25°C, unless otherwise noted. θJA is specified for the worst-case conditions, that is, a device
Table 2.
soldered in a circuit board for surface-mount packages.
Parameter Rating
Supply Voltage 18 V
Table 3. Thermal Resistance
Input Voltage VEE to VCC
Package Type θJA Unit
ISF Pin VEE to VCC 6-Lead LFCSP 160 °C/W IDRV Pin VEE to VCC Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +85°C
ESD CAUTION
Junction Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 4 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS BUFFER ELECTRICAL CHARACTERISTICS ACTIVE CURRENT LOAD ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUIT THEORY OF OPERATION SETTING ACTIVE LOAD CURRENT WITH PIN 6 (ISF) SETTING BANDWIDTH WITH PIN 4 (IDRV) APPLICATIONS INFORMATION OPEN SOURCE CCD OUTPUT BUFFER POWER SAVE MODE POWER SUPPLY BYPASSING POWER SEQUENCING OUTLINE DIMENSIONS ORDERING GUIDE
TA = 25°C, unless otherwise noted. θJA is specified for the worst-case conditions, that is, a device
Table 2.
soldered in a circuit board for surface-mount packages.
Parameter Rating
Supply Voltage 18 V
Table 3. Thermal Resistance
Input Voltage VEE to VCC
Package Type θJA Unit
ISF Pin VEE to VCC 6-Lead LFCSP 160 °C/W IDRV Pin VEE to VCC Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +85°C
ESD CAUTION
Junction Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 4 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS BUFFER ELECTRICAL CHARACTERISTICS ACTIVE CURRENT LOAD ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUIT THEORY OF OPERATION SETTING ACTIVE LOAD CURRENT WITH PIN 6 (ISF) SETTING BANDWIDTH WITH PIN 4 (IDRV) APPLICATIONS INFORMATION OPEN SOURCE CCD OUTPUT BUFFER POWER SAVE MODE POWER SUPPLY BYPASSING POWER SEQUENCING OUTLINE DIMENSIONS ORDERING GUIDE