Datasheet MCP48FXBX4/8 (Microchip) - 83

HerstellerMicrochip
Beschreibung8/10/12-Bit Quad/Octal Voltage Output, 6 LSb INL Digital-to-Analog Converters with SPI Interface
Seiten / Seite112 / 83 — MCP48FXBX4/8. 7.8. READ Command. (Normal and High Voltage). • Single …
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MCP48FXBX4/8. 7.8. READ Command. (Normal and High Voltage). • Single Read. • Continuous Reads. Note 1:. (1). (2). FIGURE 7-7:

MCP48FXBX4/8 7.8 READ Command (Normal and High Voltage) • Single Read • Continuous Reads Note 1: (1) (2) FIGURE 7-7:

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MCP48FXBX4/8 7.8 READ Command
The READ command formats include:
(Normal and High Voltage) • Single Read
The READ command is a 24-bit command and is used
• Continuous Reads
to transfer data from the specified memory location to 7.8.1 LAT PIN INTERACTION the host controller. The READ command can be issued to both the volatile and nonvolatile memory locations. During a READ command of the DACn registers, if the The format of the command, as well as an example of LAT pin transitions from VIH to VIL, then the read data SDI and SDO data, are shown in Figure 7-7. may be corrupted. This is due to the fact that the data being read are the output value and not the DAC The first seven bits of the READ command determine register value. The LAT pin transition causes an update the address and the command. The 8th clock wil out- put the CMDERR bit on the SDO pin. By means of the of the output value. Based on the DAC output value, the DACn register value and the Command bit where remaining 16 clocks, the device wil transmit the data the LAT pin transitions, the value being read could be bits of the specified address (AD4:AD0). corrupted. During an EEPROM write cycle (write to nonvolatile memory location or enable/disable Configuration bit If LAT pin transitions occur during a read of the DACn register, it is recommended that sequential reads be command), the READ command can only read the performed until the two most recent read values match. volatile memory locations. By reading the Status register (0Ah), the host controller can determine when Then the most recent read data are good. the write cycle has been completed (via the state of the 7.8.2 SINGLE READ EEWA bit). The READ command operation requires that the
Note 1:
During device communication, if an unim- CS pin be in the Active state (VIL). Typically, the CS plemented address is specified, then the pin will be in the Inactive state (VIH) and is driven to MCP48FXBX4/8 will command error that the Active state (VIL). The 24-bit READ command byte. To reset the SPI state machine, the (command byte and data byte) is then clocked in on CS pin must be driven to the VIH state. the SCK and SDI pins. The SDO pin starts driving data
2:
If the LAT pin is high (V on the 8th bit (CMDERR bit) and the addressed data IH), reads of the volatile DAC register read the output come out on the 9th through 24th clocks. value, not the internal register.
3:
The READ commands operate the same regardless of the state of the High-Voltage Command (HVC) signal. 12-bit data RR DE 10-bit data M C 8-bit data AD AD AD AD AD C C D D D D D D D D D D D D X X X X X SDI 4 3 2 1 0 1 0 11 10 09 08 07 06 05 04 03 02 01 00 * * * * * 1 1 * * * * * * * * * * * * * * * * * X X X X X X X
1
0 0 0 0 d d d d d d d d d d d d Valid
(1)
SDO X X X X X X X
0
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Invalid
(2) Note 1:
The Data bits depend on the resolution of the device: 12-bit = D11:D00, 10-bit = D09:D00, and 8-bit = D07:D00. The unimplemented bits are output as ‘0’ and data are right justified for easy host controller operation (no data manipulation after reading the register value).
2:
If an error condition occurs (CMDERR = 0), all the following SDO bits will be output as ‘0’ until the CMDERR condition is cleared (the CS pin is forced to the Inactive state).
FIGURE 7-7:
READ Command – SDI and SDO States.  2020 Microchip Technology Inc. DS20006362A-page 83 Document Outline Features Package Types General Description Applications MCP48FXBX4/8 DAC Output Channel Block Diagram MCP48FXBX4 Block Diagram (Quad-Channel Output) MCP48FXBX8 Block Diagram (Octal-Channel Output) Device Features 1.0 Electrical Characteristics Absolute Maximum Ratings(†) DC Characteristics DC Characteristics (Continued) DC Characteristics (Continued) DC Characteristics (Continued) DC Characteristics (Continued) DC Characteristics (Continued) DC Characteristics (Continued) DC Characteristics (Continued) DC Characteristics (Continued) DC Characteristics (Continued) DC Notes: 1.1 Timing Waveforms and Requirements 1.1.1 Wiper Settling Time FIGURE 1-1: VOUT Settling Time Waveforms. TABLE 1-1: Wiper Settling Timing 1.1.2 Latch Pin (LAT) Timing FIGURE 1-2: LAT Pin Waveforms. TABLE 1-2: Lat Pin Timing 1.1.3 Reset and Power-Down Timing FIGURE 1-3: Power-on and Brown-out Reset Waveforms. FIGURE 1-4: SPI Power-Down Command Waveforms. TABLE 1-3: Reset and Power-Down Timing 1.2 SPI Mode Timing Waveforms and Requirements FIGURE 1-5: SPI Timing Waveforms – Mode 1,1. FIGURE 1-6: SPI Timing (Mode 0,0) Waveforms. TABLE 1-4: SPI Requirements (Mode 1,1) TABLE 1-5: SPI Requirements (Mode 0,0) Timing Table Notes: Temperature Specifications 2.0 Typical Performance Curves 2.1 Electrical Data FIGURE 2-1: Average Device Supply Current vs. FSCK Frequency, Voltage and Temperature – Active Interface, VRnB:VRnA = 00, (VDD Mode). FIGURE 2-2: Average Device Supply Current vs. FSCK Frequency, Voltage and Temperature – Active Interface, VRnB:VRnA = 01 (Band Gap Mode). FIGURE 2-3: Average Device Supply Current vs. FSCK Frequency, Voltage and Temperature – Active Interface, VRnB:VRnA = 11 (VREF Buffered Mode). FIGURE 2-4: Average Device Supply Current – Inactive Interface (SCK = VIH or VIL) vs. Voltage and Temperature, VRnB:VRnA = 00 (VDD Mode). FIGURE 2-5: Average Device Supply Current – Inactive Interface (SCK = VIH or VIL) vs. Voltage and Temperature, VRnB:VRnA = 01 (Band Gap Mode). FIGURE 2-6: Average Device Supply Current – Inactive Interface (SCK = VIH or VIL) vs. Voltage and Temperature, VRnB:VRnA = 11 (VREF Buffered Mode). FIGURE 2-7: Average Device Supply Current vs. FSCK Frequency, Voltage and Temperature – Active Interface, VRnB:VRnA = 10 (VREF Unbuffered Mode). FIGURE 2-8: Average Device Supply Active Current (IDDA) (at 5.5V and FSCK = 20 MHz) vs. Temperature and DAC Reference Voltage Mode. FIGURE 2-9: Average Device Supply Current – Inactive Interface (SCK = VIH or VIL) vs. Voltage and Temperature, VRnB:VRnA = 10 (VREF Unbuffered Mode). FIGURE 2-10: Power-Down Currents. 2.2 Linearity Data 2.2.1 Total Unadjusted Error (TUE) – MCP48FXB28 (12-Bit), VREF = VDD (VRnB:VRnA = 00), Gain = 1x, Code 100-4000 FIGURE 2-11: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-12: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-13: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-14: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-15: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-16: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.2 Integral Nonlinearity (INL) – MCP48FXB28 (12-Bit), VREF = VDD (VRnB:VRnA = 00), Gain = 1x, Code 64-4032 FIGURE 2-17: INL Error vs. DAC Code, T = 40°C, VDD = 5.5V. FIGURE 2-18: INL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-19: INL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-20: INL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-21: INL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-22: INL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.3 Differential Nonlinearity (DNL) – MCP48FXB28 (12-Bit), VREF = VDD (VRnB:VRnA = 00), Gain = 1x, Code 64-4032 FIGURE 2-23: DNL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-24: DNL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-25: DNL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-26: DNL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-27: DNL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-28: DNL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.4 Total Unadjusted Error (TUE) – MCP48FXB28 (12-Bit), Band Gap Mode (VRnB:VRnA = 01), Gain = 2x, Code 100-4000 FIGURE 2-29: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-30: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-31: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-32: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-33: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-34: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.5 Total Unadjusted Error (TUE) – MCP48FXB28 (12-Bit), Band Gap Mode (VRnB:VRnA = 01), Gain = 4x, Code 100-4000 FIGURE 2-35: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-36: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-37: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 5.5V. 2.2.6 Integral Nonlinearity (INL) – MCP48FXB28 (12-Bit), Band Gap Mode (VRnB:VRnA = 01), Gain = 2x, Code 100-4000 FIGURE 2-38: INL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-39: INL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-40: INL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-41: INL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-42: INL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-43: INL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.7 Integral Nonlinearity (INL) – MCP48FXB28 (12-Bit), Band Gap Mode (VRnB:VRnA = 01), Gain = 4x, Code 100-4000 FIGURE 2-44: INL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-45: INL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-46: INL Error vs. DAC Code, T = +125°C, VDD = 5.5V. 2.2.8 Differential Nonlinearity Error (DNL) – MCP48FXB28 (12-Bit), Band Gap Mode (VRnB:VRnA = 01), Gain = 2x, Code 100-4000 FIGURE 2-47: DNL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-48: DNL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-49: DNL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-50: DNL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-51: DNL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-52: DNL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.9 Differential Nonlinearity Error (DNL) – MCP48FXB28 (12-Bit), Band Gap Mode (VRnB:VRnA = 01), Gain = 4x, Code 100-4000 FIGURE 2-53: DNL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-54: DNL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-55: DNL Error vs. DAC Code, T = +125°C, VDD = 5.5V. 2.2.10 Total Unadjusted Error (TUE) – MCP48FXB28 (12-Bit), External VREF Unbuffered Mode (VRnB:VRnA = 10), VREF = VDD, Gain = 1x, Code 100-4000 FIGURE 2-56: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-57: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C,VDD = 5.5V. FIGURE 2-58: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-59: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-60: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-61: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.11 Total Unadjusted Error (TUE) – MCP48FXB28 (12-Bit), External VREF Unbuffered Mode (VRnB:VRnA = 10), VREF = VDD/2, Gain = 2x, Code 100-4000 FIGURE 2-62: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-63: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C,VDD = 5.5V. FIGURE 2-64: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-65: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-66: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-67: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.12 Integral Nonlinearity Error (INL) – MCP48FXB28 (12-Bit), External VREF Mode, Unbuffered (VRnB:VRnA = 10), VREF = VDD, Gain = 1x, Code 100-4000 FIGURE 2-68: INL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-69: INL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-70: INL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-71: INL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-72: INL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-73: INL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.13 Integral Nonlinearity Error (INL) – MCP48FXB28 (12-Bit), External VREF Mode, Unbuffered (VRnB:VRnA = 10), VREF = VDD/2, Gain = 2x, Code 100-4000 FIGURE 2-74: INL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-75: INL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-76: INL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-77: INL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-78: INL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-79: INL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.14 Differential Nonlinearity Error (DNL) – MCP48FXB28 (12-Bit), External VREF Mode, Unbuffered (VRnB:VRnA = 10), VREF = VDD, Gain = 1x, Code 100-4000 FIGURE 2-80: DNL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-81: DNL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-82: DNL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-83: DNL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-84: DNL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-85: DNL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.15 Differential Nonlinearity Error (DNL) – MCP48FXB28 (12-Bit), External VREF Mode, Unbuffered (VRnB:VRnA = 10), VREF = VDD/2, Gain = 2x, Code 100-4000 FIGURE 2-86: DNL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-87: DNL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-88: DNL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-89: DNL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-90: DNL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-91: DNL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.16 Total Unadjusted Error (TUE) – MCP48FXB28 (12-Bit), External VREF Buffered Mode (VRnB:VRnA = 10), VREF = VDD, Gain = 1x, Code 100-4000 FIGURE 2-92: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-93: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C,VDD = 5.5V. FIGURE 2-94: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-95: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-96: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-97: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.17 Total Unadjusted Error (TUE) – MCP48FXB28 (12-Bit), External VREF Buffered Mode (VRnB:VRnA = 10), VREF = VDD/2, Gain = 2x, Code 100-4000 FIGURE 2-98: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-99: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C,VDD = 5.5V. FIGURE 2-100: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-101: Total Unadjusted Error (VOUT) vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-102: Total Unadjusted Error (VOUT) vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-103: Total Unadjusted Error (VOUT) vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.18 Integral Nonlinearity Error (INL) – MCP48FXB28 (12-Bit), External VREF Mode, Buffered (VRnB:VRnA = 11), VREF = VDD, Gain = 1x, Code 100-4000 FIGURE 2-104: INL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-105: INL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-106: INL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-107: INL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-108: INL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-109: INL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.19 Integral Nonlinearity Error (INL) – MCP48FXB28 (12-Bit), External VREF Mode, Buffered (VRnB:VRnA = 11), VREF = VDD/2, Gain = 2x, Code 100-4000 FIGURE 2-110: INL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-111: INL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-112: INL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-113: INL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-114: INL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-115: INL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.20 Differential Nonlinearity Error (DNL) – MCP48FXB28 (12-Bit), External VREF Mode, Buffered (VRnB:VRnA = 11), VREF = VDD, Gain = 1x, Code 100-4000 FIGURE 2-116: DNL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-117: DNL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-118: DNL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-119: DNL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-120: DNL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-121: DNL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 2.2.21 Differential Nonlinearity Error (DNL) – MCP48FXB28 (12-Bit), External VREF Mode, Buffered (VRnB:VRnA = 11), VREF = VDD/2, Gain = 2x, Code 100-4000 FIGURE 2-122: DNL Error vs. DAC Code, T = -40°C, VDD = 5.5V. FIGURE 2-123: DNL Error vs. DAC Code, T = +25°C, VDD = 5.5V. FIGURE 2-124: DNL Error vs. DAC Code, T = +125°C, VDD = 5.5V. FIGURE 2-125: DNL Error vs. DAC Code, T = -40°C, VDD = 2.7V. FIGURE 2-126: DNL Error vs. DAC Code, T = +25°C, VDD = 2.7V. FIGURE 2-127: DNL Error vs. DAC Code, T = +125°C, VDD = 2.7V. 3.0 Pin Descriptions TABLE 3-1: MCP48FXBX4 (Quad DAC) Pin Function Table TABLE 3-2: MCP48FXBX8 (Octal DAC) Pin Function Table 3.1 Positive Power Supply Input Pin (VDD) 3.2 Ground Pin (VSS) 3.3 Voltage Reference Pins (VREF) 3.4 Analog Output Voltage Pins (VOUTn) 3.5 Latch Pin (LAT)/High-Voltage Command Pin (HVC) 3.6 SPI – Chip Select Pin (CS) 3.7 SPI – Serial Data Input Pin (SDI) 3.8 SPI – Serial Data Output Pin (SDO) 3.9 SPI – Serial Clock Pin (SCK) 3.10 No Connect Pin (NC) 3.11 Exposed Pad Pin 4.0 General Description 4.1 Power-on Reset/Brown-out Reset (POR/BOR) 4.1.1 Power-on Reset 4.1.2 Brown-out Reset FIGURE 4-1: POR/BOR Operation. 4.2 Device Memory 4.2.1 Volatile Register Memory (RAM) 4.2.2 Nonvolatile Register Memory 4.2.3 Device Configuration Memory 4.2.4 Unimplemented Register Bits 4.2.5 Unimplemented (Reserved) Locations TABLE 4-1: MCP48FXBX4/8 Memory Map TABLE 4-2: Factory Default POR/BOR Values 4.2.6 WiperLock Technology TABLE 4-3: WiperLock™ Technology Configuration Bits – Functional Description 4.2.7 Device Registers 5.0 DAC Circuitry FIGURE 5-1: MCP48FXBX4/8 DAC Module Block Diagram. 5.1 Resistor Ladder FIGURE 5-2: Resistor Ladder Model. EQUATION 5-1: RS Calculation 5.2 Voltage Reference Selection FIGURE 5-3: Resistor Ladder Reference Voltage Selection Block Diagram. FIGURE 5-4: Reference Voltage Selection Implementation Block Diagram. 5.2.1 Buffered Mode 5.2.2 Unbuffered Mode 5.2.3 Band Gap Mode 5.3 Internal Band Gap TABLE 5-1: VOUT Using Band Gap 5.4 Output Buffer/VOUT Operation FIGURE 5-5: Output Driver Block Diagram. 5.4.1 Programmable Gain 5.4.2 Output Voltage EQUATION 5-2: Calculating Output Voltage (VOUT) 5.4.3 Step Voltage (VS) EQUATION 5-3: VS Calculation TABLE 5-2: Theoretical Step Voltage (VS)(1) 5.4.4 Output Slew Rate FIGURE 5-6: VOUT Pin Slew Rate. 5.4.5 Driving Resistive and Capacitive Loads FIGURE 5-7: Circuit to Stabilize the Output Buffer for Large Capacitive Loads (CL). 5.5 Power-Down Operation FIGURE 5-8: VOUT Power-Down Block Diagram. TABLE 5-3: Power-Down Bits and Output Resistive Load TABLE 5-4: DAC Current Sources 5.5.1 Exiting Power-Down 5.6 DAC Registers, Configuration Bits and Status Bits 5.7 Latch Pins (LATn) FIGURE 5-9: LAT and DAC Interaction. FIGURE 5-10: LAT Pin Operation Example. TABLE 5-5: DAC Input Code vs. Calculated Analog Output (VOUT) (VDD = 5.0V) 6.0 SPI Serial Interface Module 6.1 Overview 6.2 SPI Serial Interface FIGURE 6-1: Typical SPI Interface Block Diagram. 6.2.1 SPI Modes 6.3 Interface Pins (CS, SCK, SDI, SDO and LAT/HVC) 6.3.1 Serial Data In (SDI) 6.3.2 Serial Data Out (SDO) 6.3.3 Serial Clock (SCK) (SPI Frequency of Operation) TABLE 6-1: SCK Frequency 6.3.4 CS Signal 6.3.5 HVC Signal 6.4 Communication Data Rates 6.5 POR/BOR 7.0 SPI Device Commands TABLE 7-1: Command Bits Overview FIGURE 7-1: 8-Bit SPI Command Format. 7.1 Command Byte 7.2 Data Bytes FIGURE 7-2: 24-Bit SPI Command Format. TABLE 7-2: SPI Commands – Overview and Command Rate 7.3 Continuous Commands 7.4 Commands to Modify the Device Configuration Bits 7.5 High-Voltage Command (HVC) Signal 7.6 Error Condition 7.6.1 Aborting a Transmission 7.7 WRITE Command (Normal and High Voltage) 7.7.1 Single Write to Volatile Memory 7.7.2 Single Write to Nonvolatile Memory 7.7.3 Continuous Writes to Volatile Memory TABLE 7-3: Volatile Memory Addresses 7.7.4 Continuous Writes to Nonvolatile Memory 7.7.5 High-Voltage Command (HVC) Signal FIGURE 7-3: Write Single Memory Location Command – SDI and SDO States.(1) FIGURE 7-4: 24-Bit WRITE Command (C1:C0 = 00) – SPI Waveform (Mode 1,1). FIGURE 7-5: 24-Bit WRITE Command (C1:C0 = 00) – SPI Waveform (Mode 0,0). FIGURE 7-6: Continuous WRITE Commands (Volatile Memory Only). 7.8 READ Command (Normal and High Voltage) 7.8.1 LAT Pin Interaction 7.8.2 Single Read FIGURE 7-7: READ Command – SDI and SDO States. 7.8.3 Continuous Reads FIGURE 7-8: READ Command – Continuous Read Sequence. FIGURE 7-9: 24-Bit READ Command (C1:C0 = 11) – SPI Waveforms (Mode 1,1). FIGURE 7-10: 24-Bit READ Command (C1:C0 = 11) – SPI Waveforms (Mode 0,0). 7.9 Enable Configuration Bit (High Voltage) FIGURE 7-11: Enable Command Sequence. FIGURE 7-12: 8-Bit Enable Command (C1:C0 = 10) – SPI Waveforms (Mode 1,1). FIGURE 7-13: 8-Bit Enable Command (C1:C0 = 10) – SPI Waveforms (Mode 0,0). 7.10 Disable Configuration Bit (High Voltage) FIGURE 7-14: Disable Command Sequence. FIGURE 7-15: 8-Bit Disable Command (C1:C0 = 01) – SPI Waveforms (Mode 1,1). FIGURE 7-16: 8-Bit Disable Command (C1:C0 = 01) – SPI Waveforms (Mode 0,0). 8.0 Applications Information 8.1 Power Supply Considerations FIGURE 8-1: Example Circuit. 8.2 Layout Considerations TABLE 8-1: Package Footprint(1) 9.0 Development Support 9.1 Development Tools 9.2 Technical Documentation TABLE 9-1: Development Tools(1) TABLE 9-2: Technical Documentation FIGURE 9-1: MCP48FXBX4/8 Evaluation Board Circuit Using TSSOP20EV. 10.0 Packaging Information 10.1 Package Marking Information Appendix A: Revision History Revision A (May 2020) Appendix B: Terminology B.1 Resolution B.2 Least Significant Bit (LSb) EQUATION B-1: LSb Voltage Calculation B.3 Monotonic Operation FIGURE B-1: VW (VOUT). B.4 Full-Scale Error (EFS) EQUATION B-2: Full-Scale Error B.5 Zero-Scale Error (EZS) EQUATION B-3: Zero-Scale Error B.6 Total Unadjusted Error (ET) EQUATION B-4: Total Unadjusted Error Calculation B.7 Offset Error (EOS) FIGURE B-2: Offset Error and Zero-Scale Error. B.8 Offset Error Drift (EOSD) B.9 Gain Error (EG) FIGURE B-3: Gain Error and Full-Scale Error Example. EQUATION B-5: Example Gain Error B.10 Gain Error Drift (EGD) B.11 Integral Nonlinearity (INL) EQUATION B-6: INL Error FIGURE B-4: INL Accuracy. B.12 Differential Nonlinearity (DNL) EQUATION B-7: DNL Error FIGURE B-5: DNL Accuracy. B.13 Settling Time B.14 Major Code Transition Glitch B.15 Digital Feedthrough B.16 -3 dB Bandwidth B.17 Power Supply Sensitivity (PSS) EQUATION B-8: PSS Calculation B.18 Power Supply Rejection Ratio (PSRR) B.19 VOUT Temperature Coefficient B.20 Absolute Temperature Coefficient B.21 Noise Spectral Density Product Identification System Worldwide Sales and Service