Datasheet VEMD4010X01 (Vishay) - 4
| Hersteller | Vishay |
| Beschreibung | Silicon PIN Photodiode |
| Seiten / Seite | 7 / 4 — VEMD4010X01. REFLOW SOLDER PROFILE. DRYPACK. FLOOR LIFE. DRYING. PACKAGE … |
| Dateiformat / Größe | PDF / 147 Kb |
| Dokumentensprache | Englisch |
VEMD4010X01. REFLOW SOLDER PROFILE. DRYPACK. FLOOR LIFE. DRYING. PACKAGE DIMENSIONS
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Textversion des Dokuments
VEMD4010X01
www.vishay.com Vishay Semiconductors
REFLOW SOLDER PROFILE DRYPACK
Axis Title Devices are packed in moisture barrier bags (MBB) to 300 10000 prevent the products from moisture absorption during Max. 260 °C transportation and storage. Each bag contains a desiccant. 255 °C 250 245 °C 240 °C 217 °C
FLOOR LIFE
200 1000 Floor life (time between soldering and removing from MBB) Max. 30 s ine ne ne must not exceed the time indicated on MBB label: 150 1st li Floor life: 168 h 2nd l 2nd li Max. 120 s Max. 100 s 100 100 Conditions: Tamb < 30 °C, RH < 60 % Temperature (°C) Max. ramp down 6 °C/s Moisture sensitivity level 3, according to J-STD-020. 50 Max. ramp up 3 °C/s
DRYING
0 10 In case of moisture absorption devices should be baked 0 50 100 150 200 250 300 before soldering. Conditions see J-STD-033D or label. 19841 Time (s) Devices taped on reel dry using recommended conditions Fig. 7 - Lead (Pb)-free Reflow Solder Profile 192 h at 40 °C (+ 5 °C), RH < 5 %. According to J-STD-020
PACKAGE DIMENSIONS
in millimeters R0.26 Optical axis 2 1.12 0.15 0.7 0.95 1.25 Technical drawings 0.225 according to DIN specification 0.2 0.1 0.7 Not indicated tolerances ± 0.1 0.8 0.6 Cathode (VEMD4xxx) Collector (VEMT4xxx) Recommended footprint 0.2 1.3 1.225 0.3 0.475 0.6 Anode (VEMD4xxx) 0.9 Emitter (VEMT4xxx) Drawing-No.: 6.550-5363.01-4 Issue: 2; 01.07.2020 Rev. 1.1, 15-Jul-2020
4
Document Number: 80134 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Semiconductors
REFLOW SOLDER PROFILE DRYPACK
Axis Title Devices are packed in moisture barrier bags (MBB) to 300 10000 prevent the products from moisture absorption during Max. 260 °C transportation and storage. Each bag contains a desiccant. 255 °C 250 245 °C 240 °C 217 °C
FLOOR LIFE
200 1000 Floor life (time between soldering and removing from MBB) Max. 30 s ine ne ne must not exceed the time indicated on MBB label: 150 1st li Floor life: 168 h 2nd l 2nd li Max. 120 s Max. 100 s 100 100 Conditions: Tamb < 30 °C, RH < 60 % Temperature (°C) Max. ramp down 6 °C/s Moisture sensitivity level 3, according to J-STD-020. 50 Max. ramp up 3 °C/s
DRYING
0 10 In case of moisture absorption devices should be baked 0 50 100 150 200 250 300 before soldering. Conditions see J-STD-033D or label. 19841 Time (s) Devices taped on reel dry using recommended conditions Fig. 7 - Lead (Pb)-free Reflow Solder Profile 192 h at 40 °C (+ 5 °C), RH < 5 %. According to J-STD-020
PACKAGE DIMENSIONS
in millimeters R0.26 Optical axis 2 1.12 0.15 0.7 0.95 1.25 Technical drawings 0.225 according to DIN specification 0.2 0.1 0.7 Not indicated tolerances ± 0.1 0.8 0.6 Cathode (VEMD4xxx) Collector (VEMT4xxx) Recommended footprint 0.2 1.3 1.225 0.3 0.475 0.6 Anode (VEMD4xxx) 0.9 Emitter (VEMT4xxx) Drawing-No.: 6.550-5363.01-4 Issue: 2; 01.07.2020 Rev. 1.1, 15-Jul-2020
4
Document Number: 80134 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000