Datasheet AD8235 (Analog Devices) - 7
| Hersteller | Analog Devices |
| Beschreibung | 40 μA Micropower Instrumentation Amplifier in WLCSP Package |
| Seiten / Seite | 20 / 7 — Data Sheet. AD8235. ABSOLUTE MAXIMUM RATINGS Table 3. Parameter. Rating. … |
| Revision | A |
| Dateiformat / Größe | PDF / 515 Kb |
| Dokumentensprache | Englisch |
Data Sheet. AD8235. ABSOLUTE MAXIMUM RATINGS Table 3. Parameter. Rating. THERMAL RESISTANCE. Table 4. Thermal Resistance
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Data Sheet AD8235 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating THERMAL RESISTANCE
Supply Voltage 6 V Output Short-Circuit Current 55 mA θJA is specified for the worst-case conditions, that is, a device Input Voltage (Common Mode) ±V soldered in a circuit board for surface-mount packages. This S was measured using a standard 4-layer board, unless otherwise Differential Input Voltage ±VS specified. Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +125°C
Table 4. Thermal Resistance
Junction Temperature 125°C
Package Type PCB Power (W) θJA (°C/W)
ESD 11-Ball WLCSP CB-11-1 1S0P1 0.25 139.1 Human Body Model 1.5 kV 1.25 130 Charge Device Model 0.5 kV 2S2P2 0.25 69.5 Machine Model 200 V 1.25 68.3 1 Simulated thermal numbers per JESD51-9: Stresses at or above those listed under Absolute Maximum 1-layer PCB (1S0P), low effective thermal conductivity test board. 2 Ratings may cause permanent damage to the product. This is a 4-layer PCB (2S2P), high effective thermal conductivity test board. stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
ESD CAUTION
section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 7 of 20 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION CONNECTION DIAGRAM PIN CONFIGURATION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BASIC OPERATION GAIN SELECTION SHUTDOWN FEATURE LAYOUT RECOMMENDATIONS Pad Opening Pad Type Pad Finish Board Thickness Grounding REFERENCE TERMINAL POWER SUPPLY REGULATION AND BYPASSING INPUT BIAS CURRENT RETURN PATH INPUT PROTECTION RF INTERFERENCE COMMON-MODE INPUT VOLTAGE RANGE APPLICATIONS INFORMATION AC-COUPLED INSTRUMENTATION AMPLIFIER LOW POWER HEART RATE MONITOR OUTLINE DIMENSIONS ORDERING GUIDE
Supply Voltage 6 V Output Short-Circuit Current 55 mA θJA is specified for the worst-case conditions, that is, a device Input Voltage (Common Mode) ±V soldered in a circuit board for surface-mount packages. This S was measured using a standard 4-layer board, unless otherwise Differential Input Voltage ±VS specified. Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +125°C
Table 4. Thermal Resistance
Junction Temperature 125°C
Package Type PCB Power (W) θJA (°C/W)
ESD 11-Ball WLCSP CB-11-1 1S0P1 0.25 139.1 Human Body Model 1.5 kV 1.25 130 Charge Device Model 0.5 kV 2S2P2 0.25 69.5 Machine Model 200 V 1.25 68.3 1 Simulated thermal numbers per JESD51-9: Stresses at or above those listed under Absolute Maximum 1-layer PCB (1S0P), low effective thermal conductivity test board. 2 Ratings may cause permanent damage to the product. This is a 4-layer PCB (2S2P), high effective thermal conductivity test board. stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
ESD CAUTION
section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 7 of 20 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION CONNECTION DIAGRAM PIN CONFIGURATION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BASIC OPERATION GAIN SELECTION SHUTDOWN FEATURE LAYOUT RECOMMENDATIONS Pad Opening Pad Type Pad Finish Board Thickness Grounding REFERENCE TERMINAL POWER SUPPLY REGULATION AND BYPASSING INPUT BIAS CURRENT RETURN PATH INPUT PROTECTION RF INTERFERENCE COMMON-MODE INPUT VOLTAGE RANGE APPLICATIONS INFORMATION AC-COUPLED INSTRUMENTATION AMPLIFIER LOW POWER HEART RATE MONITOR OUTLINE DIMENSIONS ORDERING GUIDE