Datasheet AD8233 (Analog Devices) - 6

AD8233 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage 3.6 V (PCB) design and operating environment. Careful attention to Output Short-Circuit Current Duration Indefinite PCB thermal design is required. Maximum Voltage, Any Terminal1 +VS + 0.3 V Minimum Voltage, Any Terminal
Table 4. Thermal Resistance
1 −0.3 V Storage Temperature Range −65°C to +125°C
Package θJA (°C/W) θJC
Operating Temperature Range −40°C to +85°C
Type PCB Power (W) 0 ms 1 ms 2 ms (°C/W)
Maximum Junction Temperature 140°C CB-20-13 1S0P1 0.25 108.5 89.0 82.3 0.6 Electrostatic Discharge (ESD) Rating 1.25 101.1 87.3 87.3 0.6 Human Body Model (HBM) 8 kV 2S2P2 0.25 47.9 43.4 42.1 0.7 Field Induced Charged Device Model 1 kV 1.25 46.8 43.3 42.1 0.7 (FICDM) 1 Simulated thermal numbers per JESD51-9: 1-layer PCB (1S0P), low effective thermal conductivity test board. 1 This level or the maximum specified supply voltage, whichever is the lesser, 2 4-layer PCB (2S2P), high effective thermal conductivity test board. indicates the superior voltage limit for any terminal. If input voltages beyond the specified minimum or maximum voltages are expected, place resistors in series with the inputs to limit the current to less than 5 mA. Stresses at or above those listed under Absolute Maximum
ESD CAUTION
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. D | Page 6 of 32 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS INSTRUMENTATION AMPLIFIER PERFORMANCE CHARACTERISTICS OPERATIONAL AMPLIFIER PERFORMANCE CHARACTERISTICS RLD AMPLIFIER PERFORMANCE CHARACTERISTICS REFERENCE BUFFER PERFORMANCE CHARACTERISTICS SYSTEM PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ARCHITECTURE OVERVIEW INSTRUMENTATION AMPLIFIER OPERATIONAL AMPLIFIER RLD AMPLIFIER REFERENCE BUFFER FAST RESTORE CIRCUIT LEADS ON OR OFF DETECTION DC Leads On or Off Detection AC Leads On or Off Detection STANDBY OPERATION INPUT PROTECTION RADIO FREQUENCY INTERFERENCE POWER SUPPLY REGULATION AND BYPASSING INPUT REFERRED OFFSETS LAYOUT RECOMMENDATIONS APPLICATION INFORMATION ELIMINATING ELECTRODE OFFSETS HIGH-PASS FILTERING Two-Pole High-Pass Filter Additional High-Pass Filtering Options LOW-PASS FILTERING AND GAIN Driving ADCs DRIVEN ELECTRODE MEASURING SURFACE ELECTROMYOGRAPHY (EMG) OR ELECTROENCEPHALOGRAPHY (EEG) APPLICATION CIRCUITS Heart Rate Measurement (HRM) Next to the Heart Exercise Application, HRM at the Hands Holter Monitor Configuration Portable Heart Rate and Activity Monitor System Synchronous ECG and Photoplethysmography (PPG) Measurement Using Transimpedance Amplifier (TIA) ADC Mode Using the ADPD1080 USING AD5940, AD8232, AND AD8233 FOR BIOIMPEDANCE AND ELECTROCARDIOGRAM (ECG) MEASUREMENTS DIE INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE