Datasheet DA9131 (Dialog Semiconductor) - 10

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DA9131 High-Performance, Dual-Channel DC-DC Converter 3 Characteristics 3.1 Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Table 3: Absolute Maximum Ratings Parameter Description Conditions Min Max Unit
TSTG Storage temperature -65 150 °C TJ Junction temperature -40 150 °C VSYS System supply voltage -0.3 6.0 V VPIN Voltage on pins -0.3 6.0 V
3.2 Recommended Operating Conditions Table 4: Recommended Operating Conditions Parameter Description Conditions (Note 1) Min Typ Max Unit
VSYS System supply voltage 2.5 5.5 V V V SYS + PIN Voltage on pins -0.3 V 0.3 TJ Junction temperature -40 125 °C TA Ambient temperature -40 105 °C
Note 1
Within the specified limits, a lifetime of 10 years is guaranteed. If operating outside of these recommended conditions, please consult with Dialog Semiconductor.
Datasheet Revision 1.0 31-Aug-2020
CFR0011-120-00 10 of 53 © 2020 Dialog Semiconductor Document Outline General Description Key Features Benefits Applications System Diagrams Contents Table of Figures Table of Tables 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital I/O Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Resistive Divider 4.1.7 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Buck2 5.1.4 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection