Datasheet ADP1720 (Analog Devices) - 5
| Hersteller | Analog Devices |
| Beschreibung | 50 mA, High Voltage, Micropower Linear Regulator |
| Seiten / Seite | 16 / 5 — ADP1720. ABSOLUTE MAXIMUM RATINGS. Table 2. THERMAL RESISTANCE. Parameter … |
| Revision | A |
| Dateiformat / Größe | PDF / 372 Kb |
| Dokumentensprache | Englisch |
ADP1720. ABSOLUTE MAXIMUM RATINGS. Table 2. THERMAL RESISTANCE. Parameter Rating. Table 3. Thermal Resistance. Package Type. θJA
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ADP1720 ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device IN to GND –0.3 V to +30 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN or +6 V (whichever is less)
Table 3. Thermal Resistance
EN to GND –0.3 V to +30 V
Package Type θJA θJC Unit
ADJ to GND –0.3 V to +6 V 8-Lead MSOP 118 57 °C/W Storage Temperature Range –65°C to +150°C Operating Junction –40°C to +125°C Temperature Range
ESD CAUTION
Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ADJUSTABLE OUTPUT VOLTAGE(ADP1720 ADJUSTABLE) APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst-case conditions, that is, a device IN to GND –0.3 V to +30 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN or +6 V (whichever is less)
Table 3. Thermal Resistance
EN to GND –0.3 V to +30 V
Package Type θJA θJC Unit
ADJ to GND –0.3 V to +6 V 8-Lead MSOP 118 57 °C/W Storage Temperature Range –65°C to +150°C Operating Junction –40°C to +125°C Temperature Range
ESD CAUTION
Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ADJUSTABLE OUTPUT VOLTAGE(ADP1720 ADJUSTABLE) APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE