Datasheet ADP220, ADP221 (Analog Devices) - 5

Data Sheet ADP220/ADP221 ABSOLUTE MAXIMUM RATINGS Table 3.
Junction-to-ambient thermal resistance (θJA) of the package is
Parameter Rating
based on modeling and calculation using a 4-layer board. The junction-to-ambient thermal resistance is highly dependent VIN to GND –0.3 V to +6.5 V on the application and board layout. In applications where high VOUT1, VOUT2 to GND –0.3 V to VIN maximum power dissipation exists, close attention to thermal EN1, EN2 to GND –0.3 V to +6.5 V board design is required. The value of θ Storage Temperature Range –65°C to +150°C JA may vary, depending on PCB material, layout, and environmental conditions. The Operating Junction Temperature Range –40°C to +125°C specified values of θ Soldering Conditions JEDEC J-STD-020 JA are based on a four-layer, 4 inch × 3 inch, circuit board. Refer to JEDEC JESD 51-9 for detailed informa- Stresses above those listed under Absolute Maximum Ratings tion on the board construction. For additional information, may cause permanent damage to the device. This is a stress see the AN-617 Application Note, MicroCSPTM Wafer Level Chip rating only; functional operation of the device at these or any Scale Package. other conditions above those indicated in the operational ΨJB is the junction-to-board thermal characterization parameter section of this specification is not implied. Exposure to absolute with units of °C/W. ΨJB of the package is based on modeling and maximum rating conditions for extended periods may affect calculation using a 4-layer board. The JESD51-12, Guidelines device reliability. for Reporting and Using Package Thermal Information, states
THERMAL DATA
that thermal characterization parameters are not the same as thermal resistances. ΨJB measures the component power flowing Absolute maximum ratings apply individually only, not in through multiple thermal paths rather than a single path as in combination. thermal resistance, θJB. Therefore, ΨJB thermal paths include The ADP220/ADP221 can be damaged when the junction convection from the top of the package as well as radiation temperature limits are exceeded. Monitoring ambient temper- from the package. Factors that make ΨJB more useful in real- ature does not guarantee that the junction temperature (T world applications. Maximum junction temperature (T J) J) is is within the specified temperature limits. In applications calculated from the board temperature (TB) and power with high power dissipation and poor thermal resistance, the dissipation (PD) using the following formula: maximum ambient temperature may have to be derated. In TJ = TB + (PD × ΨJB) applications with moderate power dissipation and low PCB Refer to JEDEC JESD51-8 and JESD51-12 for more detailed thermal resistance, the maximum ambient temperature can information on Ψ exceed the maximum limit as long as the junction temperature JB. is within specification limits. The junction temperature (TJ) of
THERMAL RESISTANCE
the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction-to-ambient θJA and ΨJB are specified for the worst-case conditions, that is, a thermal resistance of the package (θJA). Maximum junction device soldered in a circuit board for surface-mount packages. temperature (TJ) is calculated from the ambient temperature
Table 4.
(TA) and power dissipation (PD) using the following formula:
Package Type θJA ΨJB Unit
TJ = TA + (PD × θJA) 6-Ball, 0.5 mm Pitch WLCSP 260 43.8 °C/W 6-Ball Bumped Bare Die 260 43.8 °C/W
ESD CAUTION
Rev. H | Page 5 of 20 Document Outline Features Applications Typical Application Circuits General Description Table of Contents Revision History Specifications Input and Output Capacitor, Recommended Specifications Absolute Maximum Ratings Thermal Data Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Applications Information Capacitor Selection Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties Undervoltage Lockout Enable Feature Current-Limit and Thermal Overload Protection Thermal Considerations Printed Circuit Board (PCB) Layout Considerations Outline Dimensions Ordering Guide