Datasheet ADM7160 (Analog Devices) - 6
| Hersteller | Analog Devices |
| Beschreibung | Ultralow Noise, 200 mA, Linear Regulator |
| Seiten / Seite | 24 / 6 — ADM7160. Data Sheet. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. VOUT … |
| Revision | A |
| Dateiformat / Größe | PDF / 677 Kb |
| Dokumentensprache | Englisch |
ADM7160. Data Sheet. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. VOUT 1. 6 VIN. VIN. VOUT. TOP VIEW. NC 2. 5 NC. GND. (Not to Scale). GND 3
Modelllinie für dieses Datenblatt
Textversion des Dokuments
ADM7160 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS VOUT 1 6 VIN VIN 1 5 VOUT ADM7160 ADM7160 TOP VIEW NC 2 TOP VIEW 5 NC GND 2 (Not to Scale) 7 GND 3 EPAD 4 EN EN 3 4 NC NOTES NOTES
03
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN. 1. NC = NO CONNECT. DO NOT
0
2. THE EXPOSED PAD MUST BE CONNECTED TO GROUND. CONNECT TO THIS PIN.
334- 1 -004 1
THE EXPOSED PAD ENHANCES THE THERMAL PERFORMANCE OF THE PACKAGE.
1334 1 Figure 2. Pin Configuration, 5-Lead TSOT Figure 3. Pin Configuration, 6-Lead LFCSP
Table 5. Pin Function Descriptions Pin No. TSOT LFCSP M nemonic Description
1 6 VIN Regulator Input Supply. Bypass VIN to GND with a 1 μF or greater capacitor. 2 3 GND Ground. 3 4 EN Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. 4 2, 5 NC No Connect. Do not connect to this pin. 5 1 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 μF or greater capacitor. N/A 7 EPAD Exposed Pad. The exposed pad must be connected to ground. The exposed pad enhances the thermal performance of the package. Rev. A | Page 6 of 24 Document Outline Features Applications Application Circuit General Description Table of Contents Revision History Specifications Input and Output Capacitors, Recommended Specifications Absolute Maximum Ratings Thermal Data Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Enable Feature Soft Start Current-Limit and Thermal Overload Protection Applications Information Capacitor Selection Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties Thermal Considerations PCB Layout Considerations Typical Application Circuits Outline Dimensions Ordering Guide
03
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN. 1. NC = NO CONNECT. DO NOT
0
2. THE EXPOSED PAD MUST BE CONNECTED TO GROUND. CONNECT TO THIS PIN.
334- 1 -004 1
THE EXPOSED PAD ENHANCES THE THERMAL PERFORMANCE OF THE PACKAGE.
1334 1 Figure 2. Pin Configuration, 5-Lead TSOT Figure 3. Pin Configuration, 6-Lead LFCSP
Table 5. Pin Function Descriptions Pin No. TSOT LFCSP M nemonic Description
1 6 VIN Regulator Input Supply. Bypass VIN to GND with a 1 μF or greater capacitor. 2 3 GND Ground. 3 4 EN Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. 4 2, 5 NC No Connect. Do not connect to this pin. 5 1 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 μF or greater capacitor. N/A 7 EPAD Exposed Pad. The exposed pad must be connected to ground. The exposed pad enhances the thermal performance of the package. Rev. A | Page 6 of 24 Document Outline Features Applications Application Circuit General Description Table of Contents Revision History Specifications Input and Output Capacitors, Recommended Specifications Absolute Maximum Ratings Thermal Data Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Enable Feature Soft Start Current-Limit and Thermal Overload Protection Applications Information Capacitor Selection Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties Thermal Considerations PCB Layout Considerations Typical Application Circuits Outline Dimensions Ordering Guide