Datasheet ADCMP572, ADCMP573 (Analog Devices) - 5

HerstellerAnalog Devices
BeschreibungUltrafast 3.3 V/5 V Single-Supply SiGe Comparators
Seiten / Seite14 / 5 — Data Sheet. ADCMP572/ADCMP573. ABSOLUTE MAXIMUM RATINGS. THERMAL …
RevisionB
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DokumentenspracheEnglisch

Data Sheet. ADCMP572/ADCMP573. ABSOLUTE MAXIMUM RATINGS. THERMAL CONSIDERATIONS. Table 2. Parameter Rating. ESD CAUTION

Data Sheet ADCMP572/ADCMP573 ABSOLUTE MAXIMUM RATINGS THERMAL CONSIDERATIONS Table 2 Parameter Rating ESD CAUTION

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Data Sheet ADCMP572/ADCMP573 ABSOLUTE MAXIMUM RATINGS THERMAL CONSIDERATIONS Table 2.
The ADCMP572/ADCMP573 LFCSP 16-lead package has a θ
Parameter Rating
JA (junction-to-ambient thermal resistance) of 70°C/W in still air. SUPPLY VOLTAGE Input Supply Voltage −0.5 V to +6.0 V (VCCI to GND)
ESD CAUTION
Output Supply Voltage −0.5 V to +6.0 V (VCCO to GND) Positive Supply Differential −0.5 V to +3.5 V (VCCI − VCCO) INPUT VOLTAGE Input Voltage −0.5 V to VCCI + 0.5 V Differential Input Voltage ±(VCCI + 0.5 V) Input Voltage, Latch Enable −0.5 V to V CCO + 0.5 V HYSTERESIS CONTROL PIN Applied Voltage (HYS to GND) −0.5 V to +1.5 V Maximum Input/Output Current ±1 mA OUTPUT CURRENT ADCMP572 (CML) ±20 mA ADCMP573 (RSPECL) −35 mA TEMPERATURE Operating Temperature, Ambient −40°C to +125°C Operating Temperature, Junction +150°C Storage Temperature Range −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 5 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL CONSIDERATIONS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION POWER/GROUND LAYOUT AND BYPASSING CML/RSPECL OUTPUT STAGE USING/DISABLING THE LATCH FEATURE OPTIMIZING HIGH SPEED PERFORMANCE COMPARATOR PROPAGATIONDELAY DISPERSION COMPARATOR HYSTERESIS MINIMUM INPUT SLEW RATE REQUIREMENTS TYPICAL APPLICATION CIRCUITS TIMING INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE