Datasheet HMC675LP3E (Analog Devices) - 6
| Hersteller | Analog Devices |
| Beschreibung | 10 GHz Latched Comparator with RSCML Output Stage |
| Seiten / Seite | 10 / 6 — HMC675LP3E. 10 GHz LATCHED COMPARATOR. WITH RSCML OUTPUT STAGE. Absolute … |
| Dateiformat / Größe | PDF / 556 Kb |
| Dokumentensprache | Englisch |
HMC675LP3E. 10 GHz LATCHED COMPARATOR. WITH RSCML OUTPUT STAGE. Absolute Maximum Ratings. Outline Drawing. Package Information
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Textversion des Dokuments
HMC675LP3E
v02.0312
10 GHz LATCHED COMPARATOR WITH RSCML OUTPUT STAGE Absolute Maximum Ratings
Input Supply Voltage (Vcci to GND) -0.5 V to +4 V Output Supply Voltage (Vcco to GND) -0.5 V to +4 V T Positive Supply Voltage Differential M -0.5 V to +3.3 V ELECTROSTATIC SENSITIVE DEVICE (Vcci - Vcco) OBSERVE HANDLING PRECAUTIONS Input Voltage -2 V to +2 V Differential Input Voltage -2 V to +2 V S - S Input Voltage, Latch Enable -0.5 V to Vcci +0.5 V R Applied Voltage (HYS) Vee to GND O Maximum Input Current ±20 mA Output Current 20 mA AT Junction Temperature 125 °C R Continuous Pdiss (T = 85°C) 1.74 W (Derate 43.5 mW/°C above 85°C) A P Thermal Resistance (Rth) (Junction to Lead) 23 °C/W Storage Temperature -65 °C to +150 °C Operating Temperature -40 °C to +85 °C OM ESD Sensitivity (HBM) Class 1A C
Outline Drawing
NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15 mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05 mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05 mm. 6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN 8. PADDLE MUST BE SOLDERED TO Vee..
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC675LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [1] H675 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX I F nf o or r p mati r o in cfe ur , d nish e e l d iv b e y r A y a nalo n g d t Devi o p ces i la s c bele o ieve rd d t e o rbs e : H acc iutrtatite e M and ic reli rao bl w e. a H v o e C wever o , nrp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Phoe n r O e: 7 n- 81-li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o it nle i . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
6
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 p o plic ra a tio pp n S s u @ p h por ittti : Pte ho.c n om e: 1-800-ANALOG-D
v02.0312
10 GHz LATCHED COMPARATOR WITH RSCML OUTPUT STAGE Absolute Maximum Ratings
Input Supply Voltage (Vcci to GND) -0.5 V to +4 V Output Supply Voltage (Vcco to GND) -0.5 V to +4 V T Positive Supply Voltage Differential M -0.5 V to +3.3 V ELECTROSTATIC SENSITIVE DEVICE (Vcci - Vcco) OBSERVE HANDLING PRECAUTIONS Input Voltage -2 V to +2 V Differential Input Voltage -2 V to +2 V S - S Input Voltage, Latch Enable -0.5 V to Vcci +0.5 V R Applied Voltage (HYS) Vee to GND O Maximum Input Current ±20 mA Output Current 20 mA AT Junction Temperature 125 °C R Continuous Pdiss (T = 85°C) 1.74 W (Derate 43.5 mW/°C above 85°C) A P Thermal Resistance (Rth) (Junction to Lead) 23 °C/W Storage Temperature -65 °C to +150 °C Operating Temperature -40 °C to +85 °C OM ESD Sensitivity (HBM) Class 1A C
Outline Drawing
NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15 mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05 mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05 mm. 6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN 8. PADDLE MUST BE SOLDERED TO Vee..
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC675LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [1] H675 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX I F nf o or r p mati r o in cfe ur , d nish e e l d iv b e y r A y a nalo n g d t Devi o p ces i la s c bele o ieve rd d t e o rbs e : H acc iutrtatite e M and ic reli rao bl w e. a H v o e C wever o , nrp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Phoe n r O e: 7 n- 81-li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o it nle i . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
6
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 p o plic ra a tio pp n S s u @ p h por ittti : Pte ho.c n om e: 1-800-ANALOG-D