Datasheet ADCMP380 (Analog Devices) - 10

ADCMP380 Data Sheet OUTLINE DIMENSIONS 1.000 0.960 BOTTOM VIEW 0.920 (BALL SIDE UP) 2 1 A BALL A1 1.500 IDENTIFIER 1.00 1.460 B REF 1.420 C 0.50 BSC TOP VIEW (BALL SIDE DOWN) 0.50 BSC 0.390 0.660 0.360 0.600 SIDE VIEW 0.330 0.540 COPLANARITY 0.04 SEATING 0.360 0.270 A PLANE 0.320 0.240 9 2014- 329 0.280 0.210 -00 25- G K P 08-
Figure 17. 6-Ball Wafer Level Chip Scale Package [WLCSP] (CB-6-17) Dimensions shown in millimeters
ORDERING GUIDE Model1 Temperature Range Package Description Package Option Branding
ADCMP380-1ACBZ-RL7 −40°C to +85°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-17 CW ADCMP380-2ACBZ-RL7 −40°C to +85°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-17 LQZ ADCMP380-EVALZ Evaluation Board 1 Z = RoHS Compliant Part.
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Rev. A | Page 10 of 10 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TRANSIENT IMMUNITY OUTPUT EN INPUT ADDING HYSTERESIS DEVICE OPTIONS OUTLINE DIMENSIONS ORDERING GUIDE