Datasheet RN52 (Microchip) - 6

HerstellerMicrochip
BeschreibungBluetooth Audio Module
Seiten / Seite26 / 6 — RN52. TABLE 1-4:. PIN DESCRIPTION(1) (SHEET 3 OF 3). Directio. Defau. …
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RN52. TABLE 1-4:. PIN DESCRIPTION(1) (SHEET 3 OF 3). Directio. Defau. Pin. Symbol. I/O Type. Description. Note 1:

RN52 TABLE 1-4: PIN DESCRIPTION(1) (SHEET 3 OF 3) Directio Defau Pin Symbol I/O Type Description Note 1:

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RN52 TABLE 1-4: PIN DESCRIPTION(1) (SHEET 3 OF 3) Directio Defau Pin Symbol I/O Type Description n lt
24 PCM_OUT CMOS output, with weak Synchronous data output, configurable for Output internal pull down SPDIF_OUT or SD_OUT (I2S) 25 PCM_SYNC Bidirectional with weak Synchronous data sync; WS (I2S) Output internal pull down 26 PCM_CLK CMOS input, with weak Synchronous data clock; SCK (I2S) Output internal pull down 27 GND Ground Ground 28 SPI_SS CMOS input with weak Chip select for Synchronous Serial Interface Input internal pull-up active low 29 SPI_MISO CMOS output, tri-state, with Serial Peripheral Interface (SPI) output Output weak internal pull-down 30 SPI_CLK Input with weak internal SPI clock Input pull-down 31 SPI_MOSI CMOS input, with weak SPI input Input internal pull-down 32 LED1 Open drain output Drives an LED. For the RN-52-EK Board, this Output signal drives the red LED 33 LED0 Open drain output Drives an LED. For the RN-52-EK Board, this Output signal drives the blue LED 34 MIC_BIAS Analog Microphone bias Output 35 MIC_L+ Analog Microphone input positive, left Input 36 MIC_R+ Analog Microphone input positive, right Input 37 MIC_L- Analog Microphone input negative, left Input 38 MIC_R- Analog Microphone input negative, right Input 39 AGND Analog Ground connection for audio 40 SPK_R- Analog Speaker output negative (right side) Output 41 SPK_L- Analog Speaker output negative (left side) Output 42 SPK_R+ Analog Speaker output positive (right side) Output 43 SPK_L+ Analog Speaker output positive (left side) Output 44 GND Ground Ground 45 GND Ground RF ground 46 GND Ground RF ground 47 GND Ground RF ground 48 GND Ground RF ground 49 GND Ground RF ground 50 GND Ground RF ground
Note 1:
All GPIO pins default to input with weak pull-down.
2:
Refer to the “Bluetooth Audio Module Command Reference User’s Guide” (DS50002154) and the “RN52SRC Bluetooth Audio Module Command Reference User’s Guide” (DS50002343) for more information about the behavior of the pin and optional features that can be enabled. DS70005120A-page 6  2015 Microchip Technology Inc. Document Outline RN52 Features: Applications: RN52 Block Diagram: 1.0 Device Overview TABLE 1-1: General Specifications TABLE 1-2: Weight and Dimensions TABLE 1-3: Electrical Characteristics FIGURE 1-1: Module Dimensions FIGURE 1-2: Recommended PCB Footprint FIGURE 1-3: Pin Diagram TABLE 1-4: Pin Description(1) (Sheet 1 of 3) 1.1 Audio Interface Circuit Description 1.1.1 Digital Audio Interface FIGURE 1-4: I2S and SPDIF Connections 1.1.2 Analog Audio Interface FIGURE 1-5: RN52 Audio Interface Block Diagram FIGURE 1-6: Stereo CODEC Audio Input/Output Stages 1.1.3 Analog-to-Digital Converter (ADC) FIGURE 1-7: ADC Analog Amplifier Block Diagram 1.1.4 Digital-to-Analog Converter (DAC) 1.1.4.1 Speaker Output 1.1.4.2 Microphone Input TABLE 1-5: Digital to Analog Converter TABLE 1-6: AnaLog to Digital Converter 1.2 General Purpose IO (GPIO) Ports TABLE 1-7: Digital Input and Output Voltage Levels 1.3 Power Consumption TABLE 1-8: Power Consumption 2.0 Applications 2.1 Minimizing Radio Interference FIGURE 2-1: Minimizing Radio Interference FIGURE 2-2: PCB Example Layout 2.2 LED Interface FIGURE 2-3: LED interface TABLE 2-1: Status LED Functions 2.3 Device Firmware Updates FIGURE 2-4: USB DFU Port and GPIO3 Schematic 2.4 Restore Factory Defaults with GPIO4 2.5 Power Control and Regulation 2.6 Solder Reflow Profile TABLE 2-2: Paste Solder Recommendations FIGURE 2-5: Solder Reflow Temperature Profile FIGURE 2-6: Solder Reflow Curve 2.7 Typical Application Schematic FIGURE 2-7: Typical Application Circuit for A2DP Audio Streaming and AVRCP Remote Control 3.0 Bluetooth SIG Certification 4.0 Regulatory Approval 4.1 United States 4.1.1 Labeling and User Information Requirements 4.1.2 RF Exposure 4.1.3 HELPFUL WEB SITES 4.2 Canada 4.2.1 Labeling and User Information Requirements 4.2.2 Helpful Web Sites 4.3 Europe 4.3.1 Labeling and User Information Requirements 4.3.2 Antenna Requirements 4.3.3 Helpful Web Sites TABLE 4-1: European Compliance Testing 4.4 Australia 4.4.1 Helpful Web Sites 4.5 New Zealand 4.5.1 Helpful Web Sites 5.0 Ordering Information TABLE 5-1: Ordering Information(1) 6.0 Revision History Revision A (September 2015) Notes: RN52 Bluetooth® Audio Module AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Cleveland Dallas Detroit Houston, TX Indianapolis Los Angeles New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Asia Pacific Office Hong Kong Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Wuhan China - Xian ASIA/PACIFIC China - Xiamen China - Zhuhai India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok EUROPE Austria - Wels Denmark - Copenhagen France - Paris Germany - Dusseldorf Germany - Karlsruhe Germany - Munich Italy - Milan Italy - Venice Netherlands - Drunen Poland - Warsaw Spain - Madrid Sweden - Stockholm UK - Wokingham Worldwide Sales and Service