Datasheet RN52 (Microchip)

RN52 RN52 Bluetooth® Audio Module Features:
• Fully qualified Bluetooth® version 3.0 module, • Fully compatible with Bluetooth version 2.1+EDR, 1.2, and 1.1 • Embedded Bluetooth profiles: A2DP, AVRCP, HFP/HSP and SPP • Audio decoders: SBC, AAC, aptX • Enhanced hands free voice capability narrowband and wideband codecs with cVc DSP • Software configurable through commands over UART console interface • Stereo analog differential audio output and input for highest quality audio • External Audio CODECs Supported via S/PDIF and I2S Interface • Integrated Amplifier for Driving 16Ω Speakers • Dedicated GPIO pins enable MCUs to access control and status functions efficiently • SPP data connection interface over UART • Supports wireless iAP profile advertising which is
RN52 Block Diagram:
discoverable by iOS devices (iAP protocol imple- mentation on an external host microcontroller required)
RN52
• Certifications: FCC, IC, CE, Bluetooth SIG 2 LEDs PCB Antenna Speaker • Postage Stamp sized form factor: 13.5 x 26.0 x 2.7 mm Bluetooth 3.0 MIC • Castellated SMT pads for easy and reliable PCB RF Baseband Speaker mounting • Environmental y Friendly, RoHS Compliant • Bluetooth SIG QDID 58578 MIC Audio DSP UART 16-Bit Stereo
Applications:
CODEC USB • High-quality wireless stereo headsets • Automotive hands free audio kits 11 GPIO 16-Bit RISC MCU • Wireless audio docking station for smartphones I2S Pins • High-quality wireless speakers • VoIP handsets S/PDIF 16-MBit Flash 1 AIO • Remote control for media player • Medical data devices  2015 Microchip Technology Inc. DS70005120A-page 1 Document Outline RN52 Features: Applications: RN52 Block Diagram: 1.0 Device Overview TABLE 1-1: General Specifications TABLE 1-2: Weight and Dimensions TABLE 1-3: Electrical Characteristics FIGURE 1-1: Module Dimensions FIGURE 1-2: Recommended PCB Footprint FIGURE 1-3: Pin Diagram TABLE 1-4: Pin Description(1) (Sheet 1 of 3) 1.1 Audio Interface Circuit Description 1.1.1 Digital Audio Interface FIGURE 1-4: I2S and SPDIF Connections 1.1.2 Analog Audio Interface FIGURE 1-5: RN52 Audio Interface Block Diagram FIGURE 1-6: Stereo CODEC Audio Input/Output Stages 1.1.3 Analog-to-Digital Converter (ADC) FIGURE 1-7: ADC Analog Amplifier Block Diagram 1.1.4 Digital-to-Analog Converter (DAC) 1.1.4.1 Speaker Output 1.1.4.2 Microphone Input TABLE 1-5: Digital to Analog Converter TABLE 1-6: AnaLog to Digital Converter 1.2 General Purpose IO (GPIO) Ports TABLE 1-7: Digital Input and Output Voltage Levels 1.3 Power Consumption TABLE 1-8: Power Consumption 2.0 Applications 2.1 Minimizing Radio Interference FIGURE 2-1: Minimizing Radio Interference FIGURE 2-2: PCB Example Layout 2.2 LED Interface FIGURE 2-3: LED interface TABLE 2-1: Status LED Functions 2.3 Device Firmware Updates FIGURE 2-4: USB DFU Port and GPIO3 Schematic 2.4 Restore Factory Defaults with GPIO4 2.5 Power Control and Regulation 2.6 Solder Reflow Profile TABLE 2-2: Paste Solder Recommendations FIGURE 2-5: Solder Reflow Temperature Profile FIGURE 2-6: Solder Reflow Curve 2.7 Typical Application Schematic FIGURE 2-7: Typical Application Circuit for A2DP Audio Streaming and AVRCP Remote Control 3.0 Bluetooth SIG Certification 4.0 Regulatory Approval 4.1 United States 4.1.1 Labeling and User Information Requirements 4.1.2 RF Exposure 4.1.3 HELPFUL WEB SITES 4.2 Canada 4.2.1 Labeling and User Information Requirements 4.2.2 Helpful Web Sites 4.3 Europe 4.3.1 Labeling and User Information Requirements 4.3.2 Antenna Requirements 4.3.3 Helpful Web Sites TABLE 4-1: European Compliance Testing 4.4 Australia 4.4.1 Helpful Web Sites 4.5 New Zealand 4.5.1 Helpful Web Sites 5.0 Ordering Information TABLE 5-1: Ordering Information(1) 6.0 Revision History Revision A (September 2015) Notes: RN52 Bluetooth® Audio Module AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Cleveland Dallas Detroit Houston, TX Indianapolis Los Angeles New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Asia Pacific Office Hong Kong Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Wuhan China - Xian ASIA/PACIFIC China - Xiamen China - Zhuhai India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok EUROPE Austria - Wels Denmark - Copenhagen France - Paris Germany - Dusseldorf Germany - Karlsruhe Germany - Munich Italy - Milan Italy - Venice Netherlands - Drunen Poland - Warsaw Spain - Madrid Sweden - Stockholm UK - Wokingham Worldwide Sales and Service