Datasheet RN42, RN42N (Microchip) - 10
| Hersteller | Microchip |
| Beschreibung | Class 2 Bluetooth Module with EDR Support |
| Seiten / Seite | 26 / 10 — RN42/RN42N. 2.7. Soldering Recommendations. 2.8. SPI Interface. Section … |
| Dateiformat / Größe | PDF / 1.4 Mb |
| Dokumentensprache | Englisch |
RN42/RN42N. 2.7. Soldering Recommendations. 2.8. SPI Interface. Section 3.3 “Europe”. FIGURE 2-6:. OPTIONAL SPI INTERFACE. 2.9
Modelllinie für dieses Datenblatt
- RN42-I/RM RN42-I/RM477 RN42-I/RM615 RN42-I/RM630 RN42-I/RMCOS477 RN42-I/RMETI540 RN42-I/RMEVO519 RN42-I/RMMGK477 RN42APL-I/RM RN42APL-I/RM543 RN42APL-I/RM545 RN42APL-I/RM550 RN42HCI-I/RM RN42HID-I/RM RN42N-I/RM RN42N-I/RM477 RN42N-I/RMCOS477 RN42NAPL-I/RM RN42NHCI-I/RM RN42NHID-I/RM RN42NU-I/RM RN42SM-I/RM RN42U-I/RM
Textversion des Dokuments
link to page 10
RN42/RN42N 2.7 Soldering Recommendations
The RN42/RN42N wireless module was assembled using standard lead-free reflow profile IPC/JEDEC J- STD-020. The module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles. To avoid damaging the module, the following recom- mendations are given: • Microchip Technology Application Note,” AN233 Solder Reflow Recommendation” (DS00233) pro- vides solder reflow recommendations • Do not exceed peak temperature (Tp) of 250 C° • Refer to the Solder Paste data sheet for specific reflow profile recommendations • Use no-clean flux solder paste • Do not wash as moisture can be trapped under the shield • Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
2.8 SPI Interface
The SPI Interface is primarily used for factory program- ming, test, and diagnostics. Although not required, the SPI interface is useful for restoring a corrupted flash image or enabling test modes required for certification testing. When module is installed in a final product that requires European type approval, see
Section 3.3 “Europe”
, it is recommended that the SPI interface should be accessible via 6-pin header as shown in Figure 2-6.
FIGURE 2-6: OPTIONAL SPI INTERFACE 2.9 Bluetooth SIG QDID
The RN42 has a QDID registered with the Bluetooth SIG. The manufacturer using the RN42 module in their end product can reference this QDID when filing an EPL (end product listing) to use Bluetooth® brand and logo. For more information, please visit the Bluetooth SIG at www.bluetooth.org. QDID: B014867 DS50002328A-page 10 2015 Microchip Technology Inc. Document Outline Class 2 Bluetooth® Module with EDR Support Table of Contents 1.0 Device Overview 1.1 MCU Interface 1.2 ASCII Command and Data Interface TABLE 1-1: Environmental Conditions TABLE 1-2: Electrical Characteristics TABLE 1-3: Module Dimensions TABLE 1-4: Radio Characteristics TABLE 1-5: Digital I/O Characteristics TABLE 1-6: Pin Description 2.0 Application Information 2.1 Reset Circuit 2.2 Factory Reset Using GPIO4 2.3 Connection Status TABLE 2-1: GPIO5 Status TABLE 2-2: GPIO2 Status 2.4 Module Mounting Details 2.5 External Antenna Types (RN42N) 2.6 HCI Mode 2.7 Soldering Recommendations 2.8 SPI Interface 2.9 Bluetooth SIG QDID 2.10 Application Schematic 3.0 Regulatory Approval 3.1 United States 3.2 Canada 3.3 Europe TABLE 3-1: RN42 European Compliance Testing 3.4 Australia 3.5 New Zealand 3.6 Japan 3.7 Korea 3.8 Taiwan 4.0 Ordering Information TABLE 4-1: Ordering Information(1) Worldwide Sales and Service
RN42/RN42N 2.7 Soldering Recommendations
The RN42/RN42N wireless module was assembled using standard lead-free reflow profile IPC/JEDEC J- STD-020. The module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles. To avoid damaging the module, the following recom- mendations are given: • Microchip Technology Application Note,” AN233 Solder Reflow Recommendation” (DS00233) pro- vides solder reflow recommendations • Do not exceed peak temperature (Tp) of 250 C° • Refer to the Solder Paste data sheet for specific reflow profile recommendations • Use no-clean flux solder paste • Do not wash as moisture can be trapped under the shield • Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
2.8 SPI Interface
The SPI Interface is primarily used for factory program- ming, test, and diagnostics. Although not required, the SPI interface is useful for restoring a corrupted flash image or enabling test modes required for certification testing. When module is installed in a final product that requires European type approval, see
Section 3.3 “Europe”
, it is recommended that the SPI interface should be accessible via 6-pin header as shown in Figure 2-6.
FIGURE 2-6: OPTIONAL SPI INTERFACE 2.9 Bluetooth SIG QDID
The RN42 has a QDID registered with the Bluetooth SIG. The manufacturer using the RN42 module in their end product can reference this QDID when filing an EPL (end product listing) to use Bluetooth® brand and logo. For more information, please visit the Bluetooth SIG at www.bluetooth.org. QDID: B014867 DS50002328A-page 10 2015 Microchip Technology Inc. Document Outline Class 2 Bluetooth® Module with EDR Support Table of Contents 1.0 Device Overview 1.1 MCU Interface 1.2 ASCII Command and Data Interface TABLE 1-1: Environmental Conditions TABLE 1-2: Electrical Characteristics TABLE 1-3: Module Dimensions TABLE 1-4: Radio Characteristics TABLE 1-5: Digital I/O Characteristics TABLE 1-6: Pin Description 2.0 Application Information 2.1 Reset Circuit 2.2 Factory Reset Using GPIO4 2.3 Connection Status TABLE 2-1: GPIO5 Status TABLE 2-2: GPIO2 Status 2.4 Module Mounting Details 2.5 External Antenna Types (RN42N) 2.6 HCI Mode 2.7 Soldering Recommendations 2.8 SPI Interface 2.9 Bluetooth SIG QDID 2.10 Application Schematic 3.0 Regulatory Approval 3.1 United States 3.2 Canada 3.3 Europe TABLE 3-1: RN42 European Compliance Testing 3.4 Australia 3.5 New Zealand 3.6 Japan 3.7 Korea 3.8 Taiwan 4.0 Ordering Information TABLE 4-1: Ordering Information(1) Worldwide Sales and Service