Preliminary Datasheet BM77SPPx3MC2 (Microchip) - 8
| Hersteller | Microchip |
| Beschreibung | Bluetooth 4.0 Dual Mode Module |
| Seiten / Seite | 28 / 8 — BM77SPPx3MC2. • Microchip Technology Application Note AN233 Solder Reflow … |
| Dateiformat / Größe | PDF / 741 Kb |
| Dokumentensprache | Englisch |
BM77SPPx3MC2. • Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)
Modelllinie für dieses Datenblatt
- BM77SPP03MC2-0003AA BM77SPP03MC2-0004AA BM77SPP03MC2-0006AA BM77SPP03MC2-0007AA BM77SPP03MC2-0008AA BM77SPP03MC2-0009AA BM77SPP03MC2-000AAA BM77SPP03MC2-000BAA BM77SPP05MC2-0006AA BM77SPPS3MC2-0006AA BM77SPPS3MC2-0007AA BM77SPPS3MC2-0008AA BM77SPPS3MC2-000AAA BM77SPPS3MC2-PH07AA BM77SPPS3MC2-S00AAA BM77SPPS5MC2-0004AA
Textversion des Dokuments
BM77SPPx3MC2
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• Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)
provides solder reflow recommendations
Do not exceed peak temperature (TP) of 250 deg C
Refer to the solder paste data sheet for specific reflow profile recommendations
Use no-clean flux solder paste
Do not wash as moisture can be trapped under the shield
Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. © 2014 ISSC Technologies Corp. Preliminary Revision 2.1.1 – June 16, 2015 Page 8
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• Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)
provides solder reflow recommendations
Do not exceed peak temperature (TP) of 250 deg C
Refer to the solder paste data sheet for specific reflow profile recommendations
Use no-clean flux solder paste
Do not wash as moisture can be trapped under the shield
Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. © 2014 ISSC Technologies Corp. Preliminary Revision 2.1.1 – June 16, 2015 Page 8