Preliminary Datasheet MB85RS4MTY (Fujitsu) - 2

MB85RS4MTY PIN ASSIGNMENT
(TOP VIEW) (TOP VIEW) CS 1 8 VDD CS 1 8 VDD SO 2 7 RESET SO 2 7 RESET DIE PAD 3 6 SCK WP 3 6 SCK WP VSS 4 5 SI VSS 4 5 SI (8-pin plastic SOP 208mil) (8-pin plastic DFN 5mm  6mm)
PIN FUNCTIONAL DESCRIPTIONS Pin No. Pin Name Functional description
Chip Select pin This is an input pin to make chips select. When CS is “H” level, device is in deselect 1 CS (standby) status and SO becomes High-Z. Inputs from other pins are ignored for this time. When CS is “L” level, device is in select (active) status. CS has to be “L” level before inputting op-code. Write Protect pin This is a pin to control writing to a status register. The writing of status register (see “ 3 WP STATUS REGISTER”) is protected in related with WP and WPEN. See “ WRITING PROTECT” for detail. RESET pin 7 RESET This is an input pin to make chip reset. When RESET is “L” level, device is reset and SPI interface status is initialized. Serial Clock pin 6 SCK This is a clock input pin to input/output serial data. SI is loaded synchronously to a rising edge, SO is output synchronously to a falling edge. Serial Data Input pin 5 SI This is an input pin of serial data. This inputs op-code, address, and writing data. Serial Data Output pin 2 SO This is an output pin of serial data. Reading data of FRAM memory cell array and status register data are output. This is High-Z during standby. 8 VDD Supply Voltage pin 4 VSS Ground pin DIE PAD  It is allowed for the DIE PAD on the bottom of the DFN8 package to be floating (no con- nection to anything) or to be connected to VSS. 2 DS501-00065-0v1-E Document Outline DESCRIPTION FEATURES PIN ASSIGNMENT PIN FUNCTIONAL DESCRIPTIONS BLOCK DIAGRAM SPI MODE SERIAL PERIPHERAL INTERFACE (SPI) STATUS REGISTER OP-CODE COMMAND BLOCK PROTECT WRITING PROTECT ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS 1. DC Characteristics 2. AC Characteristics 3. Pin Capacitance TIMING DIAGRAM POWER ON/OFF SEQUENCE FRAM CHARACTERISTICS NOTE ON USE ESD AND LATCH-UP REFLOW CONDITIONS AND FLOOR LIFE Current status on Contained Restricted Substances ORDERING INFORMATION PACKAGE DIMENSION MARKING (Example) PACKING INFORMATION 1. Tube 2. Emboss Tape