Datasheet BLF974P (Ampleon) - 6
| Hersteller | Ampleon |
| Beschreibung | HF / VHF power LDMOS transistor |
| Seiten / Seite | 18 / 6 — BLF974P. HF / VHF power LDMOS transistor. 7.3 Test circuit. Fig 4. … |
| Dateiformat / Größe | PDF / 1.7 Mb |
| Dokumentensprache | Englisch |
BLF974P. HF / VHF power LDMOS transistor. 7.3 Test circuit. Fig 4. Component layout for class-AB production test circuit
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BLF974P HF / VHF power LDMOS transistor 7.3 Test circuit
200.3 mm R5 C22 C10 R1 L1 L3 90 mm B1 B3 C4 R3 R7 C6 C8 C13 C15 C2 6 mm C17 C1 C19 C21 C12 C9 C20 C3 C18 6 mm C16 C14 C5 R4 L2 R8 C11 B2 C7 B4 R2 L4 R6 C23 amp01215 43.5 mm Printed-Circuit Board (PCB): Rogers RT/duroid 5880; thickness = 0.79 mm; thickness copper plating = 35 m. See Table 10 for a list of components.
Fig 4. Component layout for class-AB production test circuit Table 10. List of components
For test circuit see Figure 4.
Component Description Value Remarks
C1, C6, C7, C21 multilayer ceramic chip capacitor 1 nF ATC 100B C2, C3 multilayer ceramic chip capacitor 68 pF ATC 100B C4, C5, C10, C11 multilayer ceramic chip capacitor 4.7 F, 100 V C3225X7S2A475K200AE C8, C9 multilayer ceramic chip capacitor 51 pF ATC 100B C12 multilayer ceramic chip capacitor 20 pF ATC 800B C13, C14, C15, C16, multilayer ceramic chip capacitor 10 pF ATC 800B C17, C18 C19, C20 multilayer ceramic chip capacitor 20 pF ATC 800B C22, C23 electrolytic capacitor 1500 F, 80 V R1, R2 resistor 10 SMD 1206 R3, R4 resistor 4.7 SMD 1206 R5, R6 resistor 0.01 Ohmite: FC4L110R010FER R7, R8 resistor 2 3.6 , 0.6 W SMD 1206 L1, L2 1 mm copper wire 3 turns, D = 3 mm, l = 2.5 mm L3, L4 1 mm copper wire 4 turns, D = 3 mm, l = 3.5 mm B1, B2, B3, B4 coaxial line 50 , 58 mm HUBER+SUHNER: EZ-141-AL-TP-M17 BLF974P All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2020. All rights reserved.
Product data sheet Rev. 1 — 26 March 2020 6 of 18
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Test information 7.1 Ruggedness in class-AB operation 7.2 Impedance information 7.3 Test circuit 7.4 Graphical data 7.4.1 1-Tone CW pulsed 7.4.2 1-Tone CW 7.4.3 2-Tone CW 8. Package outline 9. Handling information 10. Abbreviations 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents
BLF974P HF / VHF power LDMOS transistor 7.3 Test circuit
200.3 mm R5 C22 C10 R1 L1 L3 90 mm B1 B3 C4 R3 R7 C6 C8 C13 C15 C2 6 mm C17 C1 C19 C21 C12 C9 C20 C3 C18 6 mm C16 C14 C5 R4 L2 R8 C11 B2 C7 B4 R2 L4 R6 C23 amp01215 43.5 mm Printed-Circuit Board (PCB): Rogers RT/duroid 5880; thickness = 0.79 mm; thickness copper plating = 35 m. See Table 10 for a list of components.
Fig 4. Component layout for class-AB production test circuit Table 10. List of components
For test circuit see Figure 4.
Component Description Value Remarks
C1, C6, C7, C21 multilayer ceramic chip capacitor 1 nF ATC 100B C2, C3 multilayer ceramic chip capacitor 68 pF ATC 100B C4, C5, C10, C11 multilayer ceramic chip capacitor 4.7 F, 100 V C3225X7S2A475K200AE C8, C9 multilayer ceramic chip capacitor 51 pF ATC 100B C12 multilayer ceramic chip capacitor 20 pF ATC 800B C13, C14, C15, C16, multilayer ceramic chip capacitor 10 pF ATC 800B C17, C18 C19, C20 multilayer ceramic chip capacitor 20 pF ATC 800B C22, C23 electrolytic capacitor 1500 F, 80 V R1, R2 resistor 10 SMD 1206 R3, R4 resistor 4.7 SMD 1206 R5, R6 resistor 0.01 Ohmite: FC4L110R010FER R7, R8 resistor 2 3.6 , 0.6 W SMD 1206 L1, L2 1 mm copper wire 3 turns, D = 3 mm, l = 2.5 mm L3, L4 1 mm copper wire 4 turns, D = 3 mm, l = 3.5 mm B1, B2, B3, B4 coaxial line 50 , 58 mm HUBER+SUHNER: EZ-141-AL-TP-M17 BLF974P All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2020. All rights reserved.
Product data sheet Rev. 1 — 26 March 2020 6 of 18
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Test information 7.1 Ruggedness in class-AB operation 7.2 Impedance information 7.3 Test circuit 7.4 Graphical data 7.4.1 1-Tone CW pulsed 7.4.2 1-Tone CW 7.4.3 2-Tone CW 8. Package outline 9. Handling information 10. Abbreviations 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents