GP2Y0A41SK0F This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCS, Halon, Carbon tetrachloride 1.1.1-Trichloroethane (Methyl chloroform) Product mass : Approx. 3.6g (TYP) This product does not contain the chemical materials regulated by RoHS directive. (Except for the NOT regulated by RoHS directive.) Compliance with each regulation 1) The RoHS directive(2002/95/EC) This product complies with the RoHS directive(2002/95/EC) . Object substances: mercury, lead (except for lead in high melting temperature type solders*1 and glass of electronic components), cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) *1 i.e. tin-lead solder alloys containing more than 85% lead 2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : ). Toxic and hazardous substances Hexavalent Polybrominated Polybrominated Category Lead Mercury Cadmium chromium biphenyls diphenyl ethers (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) Distance Measuring Sensor : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard . : indicates that the content of the toxic and hazardous substance in at least one homogeneous material of the part exceeds the concentration limit requirement as described in SJ/T 11363-2006 standard. Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead) and glass of electronic components are exempt from the RoHS directive (2002/95/EC), because there is no effective way to eliminate or substitute them by present scientific technology. Sheet No.: OP13008EN 6