Datasheet CV94D-FCC (Cree) - 10
| Hersteller | Cree |
| Beschreibung | PLCC6 3 in 1 SMD LED |
| Seiten / Seite | 11 / 10 — Cree PLCC6 3 in 1 SMD LED. CV94D-FCC. NOTES. 6. Electrostatic Discharge … |
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Cree PLCC6 3 in 1 SMD LED. CV94D-FCC. NOTES. 6. Electrostatic Discharge and Surge current. 7. Heat Management
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Cree PLCC6 3 in 1 SMD LED CV94D-FCC
Document No.: CREE-05-0057 Rev. NO. : 16
NOTES
pick up SMD products during the process of SMT production . If handling is necessary, it should take more • The packaging sizes of these car ef SMD ul to products pick up th are es v e prery od small ucts. T and he fol the lowi resin ng tw is still o meth soft ods after are ne solidification. cessary : Users are required to handle with care. Nev er touch the resin surface of SMD products. • To avoid damaging the product’s surface and interior device, it is recommended to choose a special nozzle to pick up the SMD products during the process of SMT production. If handling is necessary, take special care when picking up these products. The following method is necessary: Fig. 1a: For Small Top SMD Fig. 1b: For Mini side 0.8mm SMD For Small Top SMD series , it is recommended to use rubber material Nozzle to pick up SMD products .Two figure size for reference : a.) Circular Nozzle: inner diameter: Ø1.8mm+/-0.05mm, outer diameter: Ø2.3mm+/-0.05mm. b.) Rectangle Nozzle: inner size: 1.3mm x 2.3mm, outer size > SMD size.
6. Electrostatic Discharge and Surge current
Electrostatic discharge (ESD) or surge current (EOS) may damage SMD LED. Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling of SMD LED. All devices, equipment and machinery must be properly grounded. It is recommended to perform electrical test to screen out ESD failures at final inspection. It is important to eliminate the possibility of surge current during circuitry design
7. Heat Management
Heat management of SMD LED must be taken into consideration during the design stage of SMD LED application. The current should be de-rated appropriately by referring to the de-rating curve attached on each product specification. Data is subject to change without prior notice. Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Copyright © 2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. 10 9/9
Document No.: CREE-05-0057 Rev. NO. : 16
NOTES
pick up SMD products during the process of SMT production . If handling is necessary, it should take more • The packaging sizes of these car ef SMD ul to products pick up th are es v e prery od small ucts. T and he fol the lowi resin ng tw is still o meth soft ods after are ne solidification. cessary : Users are required to handle with care. Nev er touch the resin surface of SMD products. • To avoid damaging the product’s surface and interior device, it is recommended to choose a special nozzle to pick up the SMD products during the process of SMT production. If handling is necessary, take special care when picking up these products. The following method is necessary: Fig. 1a: For Small Top SMD Fig. 1b: For Mini side 0.8mm SMD For Small Top SMD series , it is recommended to use rubber material Nozzle to pick up SMD products .Two figure size for reference : a.) Circular Nozzle: inner diameter: Ø1.8mm+/-0.05mm, outer diameter: Ø2.3mm+/-0.05mm. b.) Rectangle Nozzle: inner size: 1.3mm x 2.3mm, outer size > SMD size.
6. Electrostatic Discharge and Surge current
Electrostatic discharge (ESD) or surge current (EOS) may damage SMD LED. Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling of SMD LED. All devices, equipment and machinery must be properly grounded. It is recommended to perform electrical test to screen out ESD failures at final inspection. It is important to eliminate the possibility of surge current during circuitry design
7. Heat Management
Heat management of SMD LED must be taken into consideration during the design stage of SMD LED application. The current should be de-rated appropriately by referring to the de-rating curve attached on each product specification. Data is subject to change without prior notice. Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Copyright © 2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. 10 9/9