Datasheet LTM8025 (Analog Devices) - 18
| Hersteller | Analog Devices |
| Beschreibung | 36V, 3A Step-Down µModule Regulator |
| Seiten / Seite | 22 / 18 — PACKAGE DESCRIPTION. 4.32mm). 9mm. LGA Package. 70-Lead (15mm |
| Revision | D |
| Dateiformat / Größe | PDF / 974 Kb |
| Dokumentensprache | Englisch |
PACKAGE DESCRIPTION. 4.32mm). 9mm. LGA Package. 70-Lead (15mm
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Textversion des Dokuments
LTM8025
PACKAGE DESCRIPTION
7 SEE NOTES C(0.30) PAD 1 LGA 70 1212 REV A A B C D E F G H J K L 1 DETAIL A 2 1.27 BSC 3 4 5 7.62 BSC 6 PACKAGE BOTTOM VIEW LTMXXXXXX µModule 7 PACKAGE IN TRAY LOADING ORIENTATION 12.70 BSC PADS 3 SEE NOTES BEVEL PAD “A1” COMPONENT TRAY PIN 1 Y AR ACKAGE Y V ×
4.32mm)
4.22 – 4.42 DETAIL B ×
9mm
Y 0.27 – 0.37
LGA Package
X SUBSTRATE S Y Z eee MOLD CAP DETAIL B DETAIL A 0.15 0.10 0.05
70-Lead (15mm
// bbb Z (Reference LTC DWG # 05-08-1817 Rev A) TOLERANCE YOUT CAREFULL PACKAGE ROW AND COLUMN LABELING MA AMONG µModule PRODUCTS. REVIEW EACH P LA 0.635 ±0.025 SQ. 70x
!
3.95 – 4.05 aaa bbb eee LL DIMENSIONS ARE IN MILLIMETERS DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE HE TOTAL NUMBER OF PADS: 70 SYMBOL NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. A 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. T 7 aaa Z 6.350 5.080 3.810 2.540 1.270 0.000 1.270 2.540 3.810 5.080 6.350 15 X Y BSC 3.810 2.540 1.270 9 0.000 BSC 1.270 TOP VIEW PACKAGE TOP VIEW 2.540 SUGGESTED PCB LAYOUT 3.810 aaa Z 4 PAD 1 CORNER Rev. D 18 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Revision History Package Photography Typical Application Related Parts
PACKAGE DESCRIPTION
7 SEE NOTES C(0.30) PAD 1 LGA 70 1212 REV A A B C D E F G H J K L 1 DETAIL A 2 1.27 BSC 3 4 5 7.62 BSC 6 PACKAGE BOTTOM VIEW LTMXXXXXX µModule 7 PACKAGE IN TRAY LOADING ORIENTATION 12.70 BSC PADS 3 SEE NOTES BEVEL PAD “A1” COMPONENT TRAY PIN 1 Y AR ACKAGE Y V ×
4.32mm)
4.22 – 4.42 DETAIL B ×
9mm
Y 0.27 – 0.37
LGA Package
X SUBSTRATE S Y Z eee MOLD CAP DETAIL B DETAIL A 0.15 0.10 0.05
70-Lead (15mm
// bbb Z (Reference LTC DWG # 05-08-1817 Rev A) TOLERANCE YOUT CAREFULL PACKAGE ROW AND COLUMN LABELING MA AMONG µModule PRODUCTS. REVIEW EACH P LA 0.635 ±0.025 SQ. 70x
!
3.95 – 4.05 aaa bbb eee LL DIMENSIONS ARE IN MILLIMETERS DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE HE TOTAL NUMBER OF PADS: 70 SYMBOL NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. A 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. T 7 aaa Z 6.350 5.080 3.810 2.540 1.270 0.000 1.270 2.540 3.810 5.080 6.350 15 X Y BSC 3.810 2.540 1.270 9 0.000 BSC 1.270 TOP VIEW PACKAGE TOP VIEW 2.540 SUGGESTED PCB LAYOUT 3.810 aaa Z 4 PAD 1 CORNER Rev. D 18 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Revision History Package Photography Typical Application Related Parts