Datasheet LTM8029 (Analog Devices) - 20
| Hersteller | Analog Devices |
| Beschreibung | 36VIN, 600mA Step-Down µModule Converter with 5µA Quiescent Current |
| Seiten / Seite | 22 / 20 — PACKAGE DESCRIPTION. BGA Package. 35-Lead (11.25mm. 6.25mm. 3.42mm). … |
| Revision | E |
| Dateiformat / Größe | PDF / 1.0 Mb |
| Dokumentensprache | Englisch |
PACKAGE DESCRIPTION. BGA Package. 35-Lead (11.25mm. 6.25mm. 3.42mm). NOTES. MAX. NOM. DIMENSIONS. MIN. SYMBOL
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Textversion des Dokuments
LTM8029
PACKAGE DESCRIPTION BGA Package 35-Lead (11.25mm
×
6.25mm
×
3.42mm)
(Reference LTC DWG # 05-08-1878 Rev Ø) TED. BGA 35 0510 REV Ø ATION PIN 1 A B C D E F G H TIONAL, 1 AIL A DET 2 Y LOADING ORIENT TOM VIEW Y BE EITHER A MOLD OR TING PLANE 3 TED WITHIN THE ZONE INDICA G 4 TION PER JESD MS-028 AND JEP95 5 PACKAGE BOT TURE LTMXXXXXX µModule PACKAGE IN TRA TUM -Z- IS SEA e Y DA F 3 AILS OF PIN #1 IDENTIFIER ARE OP b SEE NOTES DET BUT MUST BE LOCA THE PIN #1 IDENTIFIER MA MARKED FEA NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 BALL DESIGNA 4 5. PRIMAR Y PIN 1 BEVEL PIN “A1” TRA COMPONENT Z A A2 AIL B
NOTES
DET PACKAGE SIDE VIEW
MAX
3.62 0.70 2.92 0.85 0.66 0.15 0.10 0.20 0.30 0.15 b1 TE Y 0.27 – 0.37 X
NOM
3.42 0.60 2.82 0.78 0.63 11.25 6.25 1.27 8.89 5.08 A1 Z Z SUBSTRA M M
DIMENSIONS
ddd eee AL NUMBER OF BALLS: 35 AIL B
MIN
3.22 0.50 2.72 0.71 0.60 TOT ccc Z MOLD CAP DET // bbb Z AIL A DET A A1 A2 b b1 D E e F G aaa bbb ccc ddd eee Øb (35 PLACES)
SYMBOL
2.45 – 2.55 aaa Z X D Y 2.540 YOUT 1.270 0.3175 0.000 E 0.3175 1.270 TOP VIEW PACKAGE TOP VIEW 2.540 SUGGESTED PCB LA aaa Z 4 4.445 3.175 1.905 0.635 0.000 0.635 1.905 3.175 4.445 PIN “A1” CORNER 2.8575 3.4925 Rev. E 20 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Application Package Description Revision History Package Photo Design Resources Related Parts
PACKAGE DESCRIPTION BGA Package 35-Lead (11.25mm
×
6.25mm
×
3.42mm)
(Reference LTC DWG # 05-08-1878 Rev Ø) TED. BGA 35 0510 REV Ø ATION PIN 1 A B C D E F G H TIONAL, 1 AIL A DET 2 Y LOADING ORIENT TOM VIEW Y BE EITHER A MOLD OR TING PLANE 3 TED WITHIN THE ZONE INDICA G 4 TION PER JESD MS-028 AND JEP95 5 PACKAGE BOT TURE LTMXXXXXX µModule PACKAGE IN TRA TUM -Z- IS SEA e Y DA F 3 AILS OF PIN #1 IDENTIFIER ARE OP b SEE NOTES DET BUT MUST BE LOCA THE PIN #1 IDENTIFIER MA MARKED FEA NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 BALL DESIGNA 4 5. PRIMAR Y PIN 1 BEVEL PIN “A1” TRA COMPONENT Z A A2 AIL B
NOTES
DET PACKAGE SIDE VIEW
MAX
3.62 0.70 2.92 0.85 0.66 0.15 0.10 0.20 0.30 0.15 b1 TE Y 0.27 – 0.37 X
NOM
3.42 0.60 2.82 0.78 0.63 11.25 6.25 1.27 8.89 5.08 A1 Z Z SUBSTRA M M
DIMENSIONS
ddd eee AL NUMBER OF BALLS: 35 AIL B
MIN
3.22 0.50 2.72 0.71 0.60 TOT ccc Z MOLD CAP DET // bbb Z AIL A DET A A1 A2 b b1 D E e F G aaa bbb ccc ddd eee Øb (35 PLACES)
SYMBOL
2.45 – 2.55 aaa Z X D Y 2.540 YOUT 1.270 0.3175 0.000 E 0.3175 1.270 TOP VIEW PACKAGE TOP VIEW 2.540 SUGGESTED PCB LA aaa Z 4 4.445 3.175 1.905 0.635 0.000 0.635 1.905 3.175 4.445 PIN “A1” CORNER 2.8575 3.4925 Rev. E 20 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Application Package Description Revision History Package Photo Design Resources Related Parts