Datasheet LTM4622 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | Dual Ultrathin 2.5A or Single 5A Step-Down DC/DC μModule Regulator |
| Seiten / Seite | 28 / 2 — ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION (See Pin Functions, … |
| Revision | H |
| Dateiformat / Größe | PDF / 1.8 Mb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION (See Pin Functions, Pin Configuration T. able). ORDER INFORMATION
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Textversion des Dokuments
link to page 7 link to page 2 LTM4622
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN1, VIN2 ... –0.3V to 22V Operating Internal Temperature Range VOUT ... –0.3V to 6V (Note 2) .. –40°C to 125°C PGOOD1, PGOOD2 ... –0.3V to 18V Storage Temperature Range .. –55°C to 125°C RUN1, RUN2 .. –0.3V to VIN + 0.3V Peak Solder Reflow Body Temperature ...260°C INTVCC, TRACK/SS1, TRACK/SS2 .. –0.3V to 3.6V SYNC/MODE, COMP1, COMP2, FB1, FB2 ... –0.3V to INTVCC
PIN CONFIGURATION (See Pin Functions, Pin Configuration T able)
TOP VIEW TOP VIEW SYNC/ SYNC/ COMP2 GND MODE GND COMP1 COMP2 GND MODE GND COMP1 5 5 PGOOD2 FREQ PGOOD2 FREQ FB2 PGOOD1 FB2 PGOOD1 4 FB1 INTV 4 CC FB1 INTVCC TRACK/SS2 VIN1 VIN1 3 TRACK/SS2 TRACK/SS1 V 3 TRACK/SS1 IN2 VIN2 RUN2 RUN1 RUN1 2 RUN2 VIN1 2 VIN1 VIN2 GND VIN2 GND V 1 OUT2 VOUT1 V 1 OUT2 VOUT1 A B C D E A B C D E LGA PACKAGE BGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 1.82mm) 25-LEAD (6.25mm × 6.25mm × 2.42mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, WEIGHT = 0.21g WEIGHT = 0.25g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (Note 2)
LTM4622EV#PBF Au (RoHS) LTM4622V e4 LGA 4 –40°C to 125°C LTM4622IV#PBF Au (RoHS) LTM4622V e4 LGA 4 –40°C to 125°C LTM4622EY#PBF SAC305 (RoHS) LTM4622Y e1 BGA 4 –40°C to 125°C LTM4622IY#PBF SAC305 (RoHS) LTM4622Y e1 BGA 4 –40°C to 125°C LTM4622IY SnPb (63/37) LTM4622Y e0 BGA 4 –40°C to 125°C • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing • BGA Package and Tray Drawings Procedures. Rev. H 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Safety Considerations Layout Checklist/Example Package Description Revision History Package Photo Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN1, VIN2 ... –0.3V to 22V Operating Internal Temperature Range VOUT ... –0.3V to 6V (Note 2) .. –40°C to 125°C PGOOD1, PGOOD2 ... –0.3V to 18V Storage Temperature Range .. –55°C to 125°C RUN1, RUN2 .. –0.3V to VIN + 0.3V Peak Solder Reflow Body Temperature ...260°C INTVCC, TRACK/SS1, TRACK/SS2 .. –0.3V to 3.6V SYNC/MODE, COMP1, COMP2, FB1, FB2 ... –0.3V to INTVCC
PIN CONFIGURATION (See Pin Functions, Pin Configuration T able)
TOP VIEW TOP VIEW SYNC/ SYNC/ COMP2 GND MODE GND COMP1 COMP2 GND MODE GND COMP1 5 5 PGOOD2 FREQ PGOOD2 FREQ FB2 PGOOD1 FB2 PGOOD1 4 FB1 INTV 4 CC FB1 INTVCC TRACK/SS2 VIN1 VIN1 3 TRACK/SS2 TRACK/SS1 V 3 TRACK/SS1 IN2 VIN2 RUN2 RUN1 RUN1 2 RUN2 VIN1 2 VIN1 VIN2 GND VIN2 GND V 1 OUT2 VOUT1 V 1 OUT2 VOUT1 A B C D E A B C D E LGA PACKAGE BGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 1.82mm) 25-LEAD (6.25mm × 6.25mm × 2.42mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, WEIGHT = 0.21g WEIGHT = 0.25g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (Note 2)
LTM4622EV#PBF Au (RoHS) LTM4622V e4 LGA 4 –40°C to 125°C LTM4622IV#PBF Au (RoHS) LTM4622V e4 LGA 4 –40°C to 125°C LTM4622EY#PBF SAC305 (RoHS) LTM4622Y e1 BGA 4 –40°C to 125°C LTM4622IY#PBF SAC305 (RoHS) LTM4622Y e1 BGA 4 –40°C to 125°C LTM4622IY SnPb (63/37) LTM4622Y e0 BGA 4 –40°C to 125°C • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing • BGA Package and Tray Drawings Procedures. Rev. H 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Safety Considerations Layout Checklist/Example Package Description Revision History Package Photo Design Resources Related Parts