link to page 30 LTM4671 ELECTRICAL CHARACTERISTICSThe l denotes the specifications which apply over the specified internaloperating temperature range. Specified as each individual output channel. TA = 25°C (Note 2), SVIN = VIN = 12V, unless otherwisenoted. Per the typical application in Figure 30.SYMBOLPARAMETERCONDITIONSMINTYPMAX UNITS UVLO Undervoltage Lockout INTVCC Falling 2.2 2.4 2.6 V Hysteresis 0.5 V ITRACK/SS Track Pin Soft-Start Pull-Up Current TRACK/SS = 0V 1.4 µA tON(MIN) Minimum On-Time (Note 5) 20 ns tOFF(MIN) Minimum Off-Time (Note 5) 45 ns VPGOOD PGOOD Trip Level VFB with Respect to Set Output VFB Ramping Negative –10 –8 –5 % VFB Ramping Positive 5 8 10 % RPGOOD PGOOD Pull-Down Resistance 10mA Load 25 Ω INTVCC Internal VCC Voltage 3.1 3.3 3.5 V FREQ Default Switching Frequency 1 MHz MODE/CLKIN_L MODE/CLKIN_L High Threshold 1 V MODE/CLKIN_L Low Threshold 0.3 V TMON12 Temperature Monitor TA = 25°C 1.5 V Temperature Monitor Slop 200 °C/V Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 3: The minimum on-time is tested at wafer sort. may cause permanent damage to the device. Exposure to any Absolute Note 4: See output current derating curves for different VIN, VOUT and TA. Maximum Rating condition for extended periods may affect device Note 5: Guaranteed by design. reliability and lifetime. Note 6: 100% tested at wafer level. Note 2: The LTM4671 is tested under pulsed load conditions such that TJ ≈ TA. The LTM4671E is guaranteed to meet performance specifications over the 0°C to 125°C internal operating temperature range. Specifications over the full –40°C to 125°C internal operating temperature range are assured by design, characterization and correlation with statistical process controls. The LTM4671I is guaranteed to meet specifications over the full –40°C to 125°C internal operating temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. Rev. B For more information www.analog.com 5 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Component BGA Pinout Package Description Revision History Package Photo Related Parts