Datasheet VL53L3CX (STMicroelectronics)
| Hersteller | STMicroelectronics |
| Beschreibung | Time-of-Flight ranging sensor with multi target detection |
| Seiten / Seite | 35 / 1 — VL53L3CX. Features. Application. DS13204. Rev 2. February 2020 |
| Dateiformat / Größe | PDF / 1.3 Mb |
| Dokumentensprache | Englisch |
VL53L3CX. Features. Application. DS13204. Rev 2. February 2020
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VL53L3CX
Datasheet Time-of-Flight ranging sensor with multi target detection
Features
• Fully integrated miniature module – Emitter: 940 nm invisible laser (VCSEL) and its analog driver – Low-power microcontroller running advanced digital firmware – Size: 4.4 x 2.4 x 1 mm • Fast, accurate distance ranging – Histogram based technology – Up to 300 cm+ detection with full field of view (FoV) – Immune to cover glass cross-talk and fingerprint smudge at long distance with patented algorithms (direct ToF) – Dynamic fingerprint smudge compensation – Short distance, high accuracy linearity – Multi target detection and distance measurement • Typical full FoV: 25 ° • Easy integration – Reflowable component – Part-to-part or generic shape crosstalk calibration available – Single power supply – Works with many types of cover glass materials – I²C interface (up to 1 MHz) – Xshutdown (reset) and interrupt GPIO to optimize ranging operation – C and Linux full set of software drivers for turnkey ranging
Application
• Service robots and vacuum cleaners (wall following and fast obstacle detection) • Sanitary (robust user detection whatever the target reflectance) • Smart buildings and smart lighting (user detection to wake up devices) • IoT (user and object detection) • Laser assisted autofocus (AF): enhances the camera AF system speed and robustness, especially in difficult scenes (low light and low contrast); ideal companion for phase-detection autofocus (PDAF) sensors. • Video focus tracking assistance
DS13204
-
Rev 2
-
February 2020
www.st.com For further information contact your local STMicroelectronics sales office. Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents
Datasheet Time-of-Flight ranging sensor with multi target detection
Features
• Fully integrated miniature module – Emitter: 940 nm invisible laser (VCSEL) and its analog driver – Low-power microcontroller running advanced digital firmware – Size: 4.4 x 2.4 x 1 mm • Fast, accurate distance ranging – Histogram based technology – Up to 300 cm+ detection with full field of view (FoV) – Immune to cover glass cross-talk and fingerprint smudge at long distance with patented algorithms (direct ToF) – Dynamic fingerprint smudge compensation – Short distance, high accuracy linearity – Multi target detection and distance measurement • Typical full FoV: 25 ° • Easy integration – Reflowable component – Part-to-part or generic shape crosstalk calibration available – Single power supply – Works with many types of cover glass materials – I²C interface (up to 1 MHz) – Xshutdown (reset) and interrupt GPIO to optimize ranging operation – C and Linux full set of software drivers for turnkey ranging
Application
• Service robots and vacuum cleaners (wall following and fast obstacle detection) • Sanitary (robust user detection whatever the target reflectance) • Smart buildings and smart lighting (user detection to wake up devices) • IoT (user and object detection) • Laser assisted autofocus (AF): enhances the camera AF system speed and robustness, especially in difficult scenes (low light and low contrast); ideal companion for phase-detection autofocus (PDAF) sensors. • Video focus tracking assistance
DS13204
-
Rev 2
-
February 2020
www.st.com For further information contact your local STMicroelectronics sales office. Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents