Datasheet ADP1071-1, ADP1071-2 (Analog Devices) - 8

link to page 23 link to page 23
ADP1071-1 /ADP1071-2 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 5. Table 6. Thermal Resistance1 Parameter Rating Package Type θJA θJC Unit
VIN, EN 66 V RW-16 (Wide Body SOIC) 79.3 44.6 °C/W VDD2 42 V CC-24-6 (LGA) 62.1 43 °C/W VREG1 16 V 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test VREG2 6 V board. See JEDEC JESD-51. GATE −0.3 V to +16 V
Table 7. Maximum Continuous Working Voltage Wide Body
RT, CS, SYNC, SS2, FB, COMP, OVP, MODE, SR 6.5 V
SOIC1
AGND1, AGND2 ±0.3 V
Parameter Max Unit Constraint
Operating Temperature Range −40°C to +125°C Waveform Common-Mode Transients1 ±50 kV/µs AC Voltage Junction Temperature 150°C Bipolar 565 V peak Peak Solder Reflow Temperature 50-year minimum lifetime Unipolar 1131 V peak 50-year minimum lifetime SnPb Assemblies (10 sec to 30 sec) 240°C DC Voltage 1131 V peak 50-year minimum lifetime RoHS Compliant Assemblies 260°C (20 sec to 40 sec) 1 Refers to continuous voltage magnitude imposed across the isolation Electrostatic Discharge (ESD) barrier. See the Insulation Lifetime section for more details. Charged Device Model (CDM) 250 V
Table 8. Maximum Continuous Working Voltage, LGA1
Human Body Model (HBM) 1 kV
Parameter Max Unit Constraint
1 Refers to common-mode transients across the insulation barrier. Common- Waveform mode transients exceeding the absolute maximum rating can cause latch up AC Voltage or permanent damage. Bipolar 565 V peak Stresses at or above those listed under Absolute Maximum 50-year minimum lifetime Unipolar 909 V peak Limited by creepage Ratings may cause permanent damage to the product. This is a DC Voltage 565 V peak Limited by creepage stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational 1 Refers to continuous voltage magnitude imposed across the isolation section of this specification is not implied. Operation beyond barrier. See the Insulation Lifetime section for more details. the maximum operating conditions for extended periods may
ESD CAUTION
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. Rev. B | Page 8 of 27 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Insulation and Safety Related Specifications Regulatory Information Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Detailed Block Diagram Primary Side Supply, Input Voltage, and LDO Secondary Side Supply and LDO Precision Enable Soft Start Procedure Output Voltage Sensing and Feedback Loop Compensation and Steady State Operation Slope Compensation Input/Output Current-Limit Protection Temperature Sensing Frequency Setting (RT Pin) Maximum Duty Cycle Frequency Synchronization Synchronous Rectifier (SR) Driver Output Overvoltage Protection (OVP) SR Dead Time Light Load Mode (LLM) and Continuous Conduction Mode (CCM) Soft Stop OCP/Feedback Recovery Output Voltage Tracking Remote System Reset OCP Counter External Start-Up Circuit Insulation Lifetime Layout Guidelines Applications Information Typical Application Circuits Outline Dimensions Ordering Guide