Datasheet HMC361S8G, 361S8GE (Analog Devices) - 4

HMC361S8G/361S8GE
v08.1119
SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 10 GHz Package Information
4 Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC361S8G Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H361 XXXX 4 HMC361S8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H361 XXXX T HMC361S8GETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H361 T M XXXX M HMC361S8GTR Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H361 XXXX S - S 104631- Eval Board HMC361S8G S - S R [1] Max peak reflow temperature of 235 °C R O [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX O T T C C E E T
Pin Description
T E Pin Number Function Description Interface Schematic E S & D 1 OUT Divided output 180° out of phase with pin 3. S & D R R E E ID 2, 6 N/C No connection. These pins must not be grounded. ID IV IV Y D 3 OUT Divided Output. Y D C C N N E E U U Q 4 VCC Supply voltage 5V ± 0.25V. Q E E R R F F 5 IN RF Input must be DC blocked. RF Input 180° out of phase with pin 5 for differential operation. 7 IN A/C ground for single ended operation Ground Backside of package has exposed metal ground slug which 8 GND must be connected to ground. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D