Datasheet HMC363S8G, 363S8GE (Analog Devices) - 4
| Hersteller | Analog Devices |
| Beschreibung | SMT SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz |
| Seiten / Seite | 6 / 4 — HMC363S8G / 363S8GE. SMT GaAs HBT MMIC. DIVIDE-BY-8, DC - 12 GHz |
| Dateiformat / Größe | PDF / 548 Kb |
| Dokumentensprache | Englisch |
HMC363S8G / 363S8GE. SMT GaAs HBT MMIC. DIVIDE-BY-8, DC - 12 GHz
Modelllinie für dieses Datenblatt
Textversion des Dokuments
HMC363S8G / 363S8GE
v06.1119
SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP] Narrow Body (RD-8-3) Outline Drawing Dimensions shown in millimeters. 4.98
t
4.90 3.50 4.80 0.53 REF
M
3.30 3.00
s
8 5 3.99 6.20 2.50 3.90 6.00 EXPOSED PAD 2.29 3.81 5.80 2.00
s -
1 4
r
1.27 TOP VIEW BOTTOM VIEW
o
BSC 3.81 REF
t
0.50 45°
c
1.72 1.57 SIDE VIEW 0.25 END VIEW 0.25 1.37
e
1.52 0.19
t
0.25 8° SEATING 1.04 REF
e
PLANE 0.10 0° 1.27 0.46 COPLANARITY 0.41 0.36 0.10 PKG-006220 COMPLIANT TO JEDEC STANDARDS MS-012-BA 04-10-2019-A
s & D 8-Lead standard small outline Package, with exposed Pad [soic_n_eP] r narrow Body e (rD-8-3) Dimensions shown in mil imeters. iD iv
Package Information
y D Part number Package Body Material Lead Finish MsL rating Package Marking [3] c HMc363s8G Low stress injection Molded Plastic sn/Pb solder MsL1 [1] HMc363 n XXXX e HMc363s8Gtr Low stress injection Molded Plastic sn/Pb solder MsL1 [1] HMc363 XXXX u q HMc363s8Ge roHs-compliant Low stress injection Molded Plastic 100% matte sn MsL1 [2] HMc363 XXXX e HMc363s8Getr roHs-compliant Low stress injection Molded Plastic 100% matte sn MsL1 [2] HMc363 r XXXX F 104631- eval Board HMc363s8G [1] Max peak reflow temperature of 235 °c [2] Max peak reflow temperature of 260 °c [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
4
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc= 5V Operating Chracteristics Input Sensitivity Window, T= 25 °C Input Sensitivity Window vs. Temperature Output Power vs. Temperature SSB Phase Noise Performance, Pin= 0 dBm, T= 25 °C Output Harmonic Content, Pin= 0 dBm, T= 25 °C Reverse Leakage, Pin= 0 dBm, T= 25 °C Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings Typical Supply Current vs. Vcc Outline Drawing Package Information Pin Description Application Circuit Evaluation PCB List of Materials for Evaluation PCB 104631 [1]
v06.1119
SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP] Narrow Body (RD-8-3) Outline Drawing Dimensions shown in millimeters. 4.98
t
4.90 3.50 4.80 0.53 REF
M
3.30 3.00
s
8 5 3.99 6.20 2.50 3.90 6.00 EXPOSED PAD 2.29 3.81 5.80 2.00
s -
1 4
r
1.27 TOP VIEW BOTTOM VIEW
o
BSC 3.81 REF
t
0.50 45°
c
1.72 1.57 SIDE VIEW 0.25 END VIEW 0.25 1.37
e
1.52 0.19
t
0.25 8° SEATING 1.04 REF
e
PLANE 0.10 0° 1.27 0.46 COPLANARITY 0.41 0.36 0.10 PKG-006220 COMPLIANT TO JEDEC STANDARDS MS-012-BA 04-10-2019-A
s & D 8-Lead standard small outline Package, with exposed Pad [soic_n_eP] r narrow Body e (rD-8-3) Dimensions shown in mil imeters. iD iv
Package Information
y D Part number Package Body Material Lead Finish MsL rating Package Marking [3] c HMc363s8G Low stress injection Molded Plastic sn/Pb solder MsL1 [1] HMc363 n XXXX e HMc363s8Gtr Low stress injection Molded Plastic sn/Pb solder MsL1 [1] HMc363 XXXX u q HMc363s8Ge roHs-compliant Low stress injection Molded Plastic 100% matte sn MsL1 [2] HMc363 XXXX e HMc363s8Getr roHs-compliant Low stress injection Molded Plastic 100% matte sn MsL1 [2] HMc363 r XXXX F 104631- eval Board HMc363s8G [1] Max peak reflow temperature of 235 °c [2] Max peak reflow temperature of 260 °c [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
4
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc= 5V Operating Chracteristics Input Sensitivity Window, T= 25 °C Input Sensitivity Window vs. Temperature Output Power vs. Temperature SSB Phase Noise Performance, Pin= 0 dBm, T= 25 °C Output Harmonic Content, Pin= 0 dBm, T= 25 °C Reverse Leakage, Pin= 0 dBm, T= 25 °C Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings Typical Supply Current vs. Vcc Outline Drawing Package Information Pin Description Application Circuit Evaluation PCB List of Materials for Evaluation PCB 104631 [1]