Datasheet HMC862A (Analog Devices) - 6

link to page 12 link to page 12 link to page 12
HMC862A Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS D D CC CC V GN GN V 61 51 41 31 GND 1 12 GND IN 2 HMC862A 11 OUT TOP VIEW IN 3 10 OUT (Not to Scale) GND 4 9 GND 5 6 7 8 PACKAGE BASE S0 S1 S2 D GND GN NOTES
02 0
1. EXPOSED PAD. EXPOSED PAD MUST
9-
BE CONNECTED TO RF/DC GROUND.
59 13 Figure 2. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1, 4, 8, 9, GND Ground. The backside of the package has an exposed metal ground slug that must be connected to RF/dc ground. 12, 14, 15 2 IN RF Input. This pin must be dc blocked. 3 IN RF Input, 180° Out of Phase with Pin 2 for Differential Operation. This pin must be ac grounded for single-ended operation. DC block this pin for differential operation. 5, 6, 7 S0, S1, S2 CMOS Compatible Division Ratio Control Bits. See Table 6. 10 OUT Divider Output, 180° Out of Phase with Pin 11. This RF output must be dc blocked. See Figure 31 for proper termination. 11 OUT Divided Output. This RF output must be dc blocked. See Figure 31 for proper termination. 13, 16 VCC Supply Voltage Pins, 5 V. Connect both VCC pins to a 5 V supply. These pins are internally connected. EPAD Exposed Pad. Exposed pad must be connected to RF/dc ground. Rev. A | Page 6 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS RF SPECIFICATIONS DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS DIVIDE BY 1 DIVIDE BY 2 DIVIDE BY 4 DIVIDE BY 8 CURRENT CONSUMPTION (ICC) THEORY OF OPERATION INPUT INTERFACE OUTPUT INTERFACE APPLICATIONS INFORMATION EVALUATION PRINTED CIRCUIT BOARD (PCB) EVALUATION BOARD OVERVIEW OUTLINE DIMENSIONS ORDERING GUIDE