Datasheet VSC7440 (Microchip) - 8

link to page 411 link to page 413 link to page 413 link to page 414 link to page 416 link to page 416 link to page 416 link to page 417 link to page 417 link to page 417 link to page 418 link to page 419 link to page 419 link to page 420 link to page 421 link to page 422 link to page 422 link to page 422 link to page 423 link to page 423 link to page 423 link to page 424 link to page 424 link to page 424 link to page 425 link to page 425 link to page 426 link to page 428 link to page 431 link to page 434 link to page 434 link to page 435 link to page 436 link to page 437 link to page 437 link to page 437 link to page 437 link to page 437 link to page 438 link to page 438 link to page 439 link to page 439 link to page 439 link to page 440 link to page 440 link to page 441 link to page 443 link to page 444 6.2.12 JTAG Interface . 394 6.2.13 Serial Inputs/Outputs . 396 6.2.14 Recovered Clock Outputs . 396 6.2.15 Two-Wire Serial Interface . 397 6.2.16 IEEE 1588 Time Tick Outputs . 399 6.3 Current and Power Consumption . 399 6.3.1 Current Consumption . 399 6.3.2 Power Consumption . 400 6.3.3 Power Supply Sequencing . 400 6.4 Operating Conditions . 400 6.5 Stress Ratings . 401 7 Pin Descriptions . 402 7.1 Pin Diagram . 402 7.2 Pins by Function . 403 7.2.1 DDR SDRAM Interface . 404 7.2.2 General-Purpose Inputs and Outputs . 405 7.2.3 JTAG Interface . 405 7.2.4 MII Management Interface . 405 7.2.5 Miscellaneous . 406 7.2.6 PCI Express Interface . 406 7.2.7 Power Supplies and Ground . 406 7.2.8 SERDES1G . 407 7.2.9 SERDES6G . 407 7.2.10 SERDES10G . 407 7.2.11 Serial CPU Interface . 408 7.2.12 System Clock Interface . 408 7.2.13 Twisted Pair Interface . 409 7.3 Pins by Number . 411 7.4 Pins by Name . 414 8 Package Information . 417 8.1 Package Drawing . 417 8.2 Thermal Specifications . 418 8.3 Moisture Sensitivity . 419 9 Design Guidelines . 420 9.1 Power Supplies . 420 9.2 Power Supply Decoupling . 420 9.2.1 Reference Clock . 420 9.2.2 Single-Ended REFCLK Input . 420 9.3 Interfaces . 421 9.3.1 General Recommendations . 421 9.3.2 SerDes Interfaces (SGMII, 2.5G, 10G) . 422 9.3.3 Serial Interface . 422 9.3.4 PCI Express Interface . 422 9.3.5 Two-Wire Serial Interface . 423 9.3.6 DDR3 SDRAM Interface . 423 9.3.7 Thermal Diode External Connection . 424 10 Design Considerations . 426 11 Ordering Information . 427 VMDS-10492 VSC7440 Datasheet Revision 4.2 vi Document Outline 1 Revision History 1.1 Revision 4.2 1.2 Revision 4.1 1.3 Revision 4.0 2 Product Overview 2.1 General Features 2.1.1 Layer 2 and Layer 3 Forwarding 2.1.2 Timing and Synchronization 2.1.3 Quality of Service 2.1.4 Security 2.1.5 Management 2.1.6 Product Parameters 2.2 Applications 3 Functional Descriptions 3.1 Register Notations 3.2 Functional Overview 3.2.1 Frame Arrival in Ports and Port Modules 3.2.2 Basic Classification 3.2.3 Security and Control Protocol Classification 3.2.4 Policing 3.2.5 Layer 2 Forwarding 3.2.6 Layer 3 Forwarding 3.2.7 Shared Queue System and Hierarchical Scheduler 3.2.8 Rewriter and Frame Departure 3.2.9 CPU Port Module 3.2.10 Synchronous Ethernet and Precision Time Protocol (PTP) 3.2.11 CPU Subsystem 3.3 Frame Headers 3.3.1 Internal Frame Header Placement 3.3.2 Internal Frame Header Layout 3.3.3 VStaX Header 3.4 Port Numbering and Mappings 3.4.1 Supported SerDes Interfaces 3.4.2 Dual-Media Mode 3.4.3 10G Modes 3.4.4 Logical Port Numbers 3.5 SERDES1G 3.6 SERDES6G 3.7 SERDES10G 3.8 Copper Transceivers 3.8.1 Register Access 3.8.2 Cat5 Twisted Pair Media Interface 3.8.3 Wake-On-LAN and SecureOn 3.8.4 Ethernet Inline Powered Devices 3.8.5 IEEE 802.3af PoE Support 3.8.6 ActiPHY™ Power Management 3.8.7 Testing Features 3.8.8 VeriPHY™ Cable Diagnostics 3.9 DEV1G and DEV2G5 Port Modules 3.9.1 MAC 3.9.2 Half-Duplex Mode 3.9.3 Physical Coding Sublayer (PCS) 3.9.4 Port Statistics 3.10 DEV10G Port Module 3.10.1 MAC 3.10.2 Physical Coding Sublayer (PCS) 3.10.3 Port Statistics 3.11 Assembler 3.11.1 Setting Up a Port in the Assembler 3.11.2 Setting Up a Port for Frame Injection 3.11.3 Setting Up MAC Control Sublayer PAUSE Frame Detection 3.11.4 Setting Up PFC 3.11.5 Setting Up Assembler Port Statistics 3.11.6 Setting Up the Loopback Path 3.12 Versatile Content-Aware Processor (VCAP) 3.12.1 Configuring VCAP 3.12.2 Wide VCAP Entries and Actions 3.12.3 Individual VCAPs 3.12.4 VCAP Programming Examples 3.13 Pipeline Points 3.13.1 Pipeline Definitions 3.14 Analyzer 3.14.1 Initializing the Analyzer 3.15 VCAP CLM Keys and Actions 3.15.1 Keys Overview 3.15.2 VCAP CLM X1 Key Details 3.15.3 VCAP CLM X2 Key Details 3.15.4 VCAP CLM X4 Key Details 3.15.5 VCAP CLM X8 Key Details 3.15.6 VCAP CLM X16 Key Details 3.15.7 VCAP CLM Actions 3.16 Analyzer Classifier 3.16.1 Basic Classifier 3.16.2 VCAP CLM Processing 3.16.3 QoS Mapping Table 3.16.4 Analyzer Classifier Diagnostics 3.17 VLAN and MSTP 3.17.1 Private VLAN 3.17.2 VLAN Pseudo Code 3.18 VCAP LPM: Keys and Action 3.18.1 VCAP LPM SGL_IP4 Key Details 3.18.2 VCAP LPM DBL_IP4 Key Details 3.18.3 VCAP LPM SGL_IP6 Key Details 3.18.4 VCAP LPM DBL_IP6 Key Details 3.18.5 VCAP LPM Actions 3.19 IP Processing 3.19.1 IP Source/Destination Guard 3.19.2 IP Routing 3.19.3 Statistics 3.19.4 IGMP/MLD Snooping Switch 3.20 VCAP IS2 Keys and Actions 3.20.1 VCAP IS2 Keys 3.20.2 VCAP IS2 Actions 3.21 Analyzer Access Control Lists 3.21.1 VCAP IS2 3.21.2 Analyzer Access Control List Frame Rewriting 3.22 Analyzer Layer 2 Forwarding and Learning 3.22.1 Analyzer MAC Table 3.22.2 MAC Table Updates 3.22.3 CPU Access to MAC Table 3.22.4 SCAN Command 3.22.5 Forwarding Lookups 3.22.6 Source Check and Automated Learning 3.22.7 Automated Aging (AUTOAGE) 3.22.8 Interrupt Handling 3.23 Analyzer Access Control Forwarding, Policing, and Statistics 3.23.1 Mask Handling 3.23.2 Policing 3.23.3 Analyzer Statistics 3.23.4 Analyzer sFlow Sampling 3.23.5 Mirroring 3.24 Shared Queue System and Hierarchical Scheduler 3.24.1 Analyzer Result 3.24.2 Buffer Control 3.24.3 Forwarding 3.24.4 Congestion Control 3.24.5 Queue Mapping 3.24.6 Queue Congestion Control 3.24.7 Scheduling 3.24.8 Queue System Initialization 3.24.9 Miscellaneous Features 3.25 Automatic Frame Injector 3.25.1 Injection Tables 3.25.2 Frame Table 3.25.3 Delay Triggered Injection 3.25.4 Timer Triggered Injection 3.25.5 Injection Queues 3.25.6 Adding Injection Frame 3.25.7 Starting Injection 3.25.8 Stopping Injection 3.25.9 Removing Injection Frames 3.25.10 Port Parameters 3.26 Rewriter 3.26.1 Rewriter Operation 3.26.2 Supported Ports 3.26.3 Supported Frame Formats 3.26.4 Rewriter Initialization 3.26.5 VCAP_ES0 Lookup 3.26.6 Mapping Tables 3.26.7 VLAN Editing 3.26.8 DSCP Remarking 3.26.9 VStaX Header Insertion 3.26.10 Forwarding to GCPU 3.26.11 Layer 3 Routing 3.26.12 Mirror Frames 3.26.13 Internal Frame Header Insertion 3.26.14 Frame Injection from Internal CPU 3.27 Disassembler 3.27.1 Setting Up Ports 3.27.2 Maintaining the Cell Buffer 3.27.3 Setting Up MAC Control Sublayer PAUSE Function 3.27.4 Setting up Flow Control in Half-Duplex Mode 3.27.5 Setting Up Frame Aging 3.27.6 Setting Up Transmit Data Rate Limiting 3.27.7 Error Detection 3.28 Layer 1 Timing 3.29 Hardware Time Stamping 3.29.1 One-Step Functions 3.29.2 Calculation Overview 3.29.3 Detecting Calculation Issues 3.29.4 Two-Step Functions 3.29.5 Time of Day Time Stamping 3.29.6 Time of Day Generation 3.29.7 Multiple PTP Time Domains 3.29.8 Register Interface to 1588 Functions 3.29.9 Configuring I/O Delays 3.30 VRAP Engine 3.30.1 VRAP Request Frame Format 3.30.2 VRAP Response Frame Format 3.30.3 VRAP Header Format 3.30.4 VRAP READ Command 3.30.5 VRAP READ-MODIFY-WRITE Command 3.30.6 VRAP IDLE Command 3.30.7 VRAP PAUSE Command 3.31 Energy Efficient Ethernet 3.32 CPU Injection and Extraction 3.32.1 Frame Injection 3.32.2 Frame Extraction 3.32.3 Forwarding to CPU 3.32.4 Automatic Frame Injection (AFI) 3.33 Priority-Based Flow Control (PFC) 3.33.1 PFC Pause Frame Generation 3.33.2 PFC Frame Reception 3.34 Protection Switching 3.34.1 Ethernet Ring Protection Switching 3.34.2 Link Aggregation 3.34.3 Port Protection Switching 3.35 Low Power Mode 3.35.1 One-Time Configurations for Low Power Mode 3.35.2 General Considerations in Low Power Mode 3.36 Clocking and Reset 3.36.1 Pin Strapping 4 VCore-III System and CPU Interfaces 4.1 VCore-III Configurations 4.2 Clocking and Reset 4.2.1 Watchdog Timer 4.3 Shared Bus 4.3.1 VCore-III Shared Bus Arbitration 4.3.2 Chip Register Region 4.3.3 SI Flash Region 4.3.4 DDR3/DDR3L Region 4.3.5 PCIe Region 4.4 VCore-III CPU 4.4.1 Little Endian and Big Endian Support 4.4.2 Software Debug and Development 4.5 External CPU Support 4.5.1 Register Access and Multimaster Systems 4.5.2 Serial Interface in Slave Mode 4.5.3 MIIM Interface in Slave Mode 4.5.4 Access to the VCore Shared Bus 4.5.5 Mailbox and Semaphores 4.6 PCIe Endpoint Controller 4.6.1 Accessing Endpoint Registers 4.6.2 Enabling the Endpoint 4.6.3 Base Address Registers Inbound Requests 4.6.4 Outbound Interrupts 4.6.5 Outbound Access 4.6.6 Power Management 4.6.7 Device Reset Using PCIe 4.7 Frame DMA 4.7.1 DMA Control Block Structures 4.7.2 Enabling and Disabling FDMA Channels 4.7.3 Channel Counters 4.7.4 FDMA Events and Interrupts 4.7.5 FDMA Extraction 4.7.6 FDMA Injection 4.7.7 Manual Mode 4.8 VCore-III System Peripherals 4.8.1 SI Boot Controller 4.8.2 SI Master Controller 4.8.3 DDR3/DDR3L Memory Controller 4.8.4 Timers 4.8.5 UARTs 4.8.6 Two-Wire Serial Interface 4.8.7 MII Management Controller 4.8.8 GPIO Controller 4.8.9 Serial GPIO Controller 4.8.10 Fan Controller 4.8.11 Temperature Sensor 4.8.12 Memory Integrity Monitor 4.8.13 Interrupt Controller 5 Registers 6 Electrical Specifications 6.1 DC Characteristics 6.1.1 Reference Clock 6.1.2 PLL Clock Output 6.1.3 DDR3/DDR3L SDRAM Interface 6.1.4 SERDES1G 6.1.5 SERDES6G 6.1.6 SERDES10G 6.1.7 GPIO, SI, JTAG, and Miscellaneous Signals 6.1.8 Thermal Diode 6.2 AC Characteristics 6.2.1 Reference Clock 6.2.2 PLL Clock Outputs 6.2.3 SERDES1G 6.2.4 SERDES6G 6.2.5 SERDES10G 6.2.6 Reset Timing 6.2.7 MII Management 6.2.8 Serial Interface (SI) Boot Master Mode 6.2.9 Serial Interface (SI) Master Mode 6.2.10 Serial Interface (SI) for Slave Mode 6.2.11 DDR SDRAM Interface 6.2.12 JTAG Interface 6.2.13 Serial Inputs/Outputs 6.2.14 Recovered Clock Outputs 6.2.15 Two-Wire Serial Interface 6.2.16 IEEE 1588 Time Tick Outputs 6.3 Current and Power Consumption 6.3.1 Current Consumption 6.3.2 Power Consumption 6.3.3 Power Supply Sequencing 6.4 Operating Conditions 6.5 Stress Ratings 7 Pin Descriptions 7.1 Pin Diagram 7.2 Pins by Function 7.2.1 DDR SDRAM Interface 7.2.2 General-Purpose Inputs and Outputs 7.2.3 JTAG Interface 7.2.4 MII Management Interface 7.2.5 Miscellaneous 7.2.6 PCI Express Interface 7.2.7 Power Supplies and Ground 7.2.8 SERDES1G 7.2.9 SERDES6G 7.2.10 SERDES10G 7.2.11 Serial CPU Interface 7.2.12 System Clock Interface 7.2.13 Twisted Pair Interface 7.3 Pins by Number 7.4 Pins by Name 8 Package Information 8.1 Package Drawing 8.2 Thermal Specifications 8.3 Moisture Sensitivity 9 Design Guidelines 9.1 Power Supplies 9.2 Power Supply Decoupling 9.2.1 Reference Clock 9.2.2 Single-Ended REFCLK Input 9.3 Interfaces 9.3.1 General Recommendations 9.3.2 SerDes Interfaces (SGMII, 2.5G, 10G) 9.3.3 Serial Interface 9.3.4 PCI Express Interface 9.3.5 Two-Wire Serial Interface 9.3.6 DDR3 SDRAM Interface 9.3.7 Thermal Diode External Connection 10 Design Considerations 11 Ordering Information