KSZ9893RNXTO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com . We welcome your feedback. Most Current Documentation To obtain the most up-to-date version of this documentation, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for cur- rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS00002318A-page 2 2016 Microchip Technology Inc. Document Outline Highlights Target Applications Features 1.0 Introduction 1.1 General Description FIGURE 1-1: Internal Block Diagram 2.0 Package Information 2.1 Package Drawings FIGURE 2-1: Package (Drawing) FIGURE 2-2: Package (Dimensions) FIGURE 2-3: Package (Land Pattern) Appendix A: PRODUCT BRIEF Revision History The Microchip Web Site Product Identification System Worldwide Sales and Service