Datasheet ADN8810 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | 12-Bit High Output Current Source |
| Seiten / Seite | 14 / 2 — ADN8810. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY 11/2017—Rev. B. … |
| Revision | C |
| Dateiformat / Größe | PDF / 443 Kb |
| Dokumentensprache | Englisch |
ADN8810. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY 11/2017—Rev. B. to Rev. C. 3/2016—Rev. A to Rev. B
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ADN8810 Data Sheet TABLE OF CONTENTS
Features .. 1 Setting Full-Scale Output Current ... 10 Applications ... 1 Power Supplies .. 10 Functional Block Diagram .. 1 Serial Data Interface ... 10 General Description ... 1 Standby and Reset Modes ... 11 Revision History ... 2 Power Dissipation... 11 Specifications ... 3 Using Multiple ADN8810 Devices for Additional Output Current ... 11 Timing Characteristics .. 4 Adding Dither to the Output Current ... 12 Absolute Maximum Ratings .. 5 Driving Common-Anode Laser Diodes ... 12 ESD Caution .. 5 PCB Layout Recommendations ... 13 Pin Configuration and Function Descriptions ... 6 Suggested Pad Layout for CP-24 Package ... 13 Typical Performance Characteristics ... 7 Outline Dimensions ... 14 Terminology .. 9 Ordering Guide .. 14 Functional Description .. 10
REVISION HISTORY 11/2017—Rev. B. to Rev. C 3/2016—Rev. A to Rev. B
Changed RS to RSN .. Throughout Changes to Figure 3 and Table 4 .. 7 Change to Figure 1 ... 1 Updated Outline Dimensions ... 15 Changes to Maximum Ful -Scale Output Current Parameter Changes to Ordering Guide .. 15 and Power Supply Rejection Ratio Parameter, Table 1 .. 3 Moved Timing Characteristics Section, Table 2, and Figure 2 ... 4
4/2009—Rev. 0 to Rev. A
Added Lead Temperature Range (Soldering 10 sec) Parameter, Changes to Table 3 ... 6 Table 3 .. 5 Changes to Figure 25 .. 14 Changes to Figure 3 and Table 4 ... 6 Updated Outline Dimensions ... 15 Changes to Setting Ful -Scale Output Current Section ... 10 Changes to Ordering Guide .. 15 Changes to Adding Dither to the Output Current Section, Figure 20, and Figure 21 .. 12
1/2004—Revision 0: Initial Version
Changes to PCB Layout Recommendations Section and Figure 25 .. 13 Updated to Outline Dimensions .. 14 Rev. C | Page 2 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY FUNCTIONAL DESCRIPTION SETTING FULL-SCALE OUTPUT CURRENT POWER SUPPLIES SERIAL DATA INTERFACE STANDBY AND RESET MODES POWER DISSIPATION USING MULTIPLE ADN8810 DEVICES FOR ADDITIONAL OUTPUT CURRENT ADDING DITHER TO THE OUTPUT CURRENT DRIVING COMMON-ANODE LASER DIODES PCB LAYOUT RECOMMENDATIONS SUGGESTED PAD LAYOUT FOR CP-24 PACKAGE OUTLINE DIMENSIONS ORDERING GUIDE
ADN8810 Data Sheet TABLE OF CONTENTS
Features .. 1 Setting Full-Scale Output Current ... 10 Applications ... 1 Power Supplies .. 10 Functional Block Diagram .. 1 Serial Data Interface ... 10 General Description ... 1 Standby and Reset Modes ... 11 Revision History ... 2 Power Dissipation... 11 Specifications ... 3 Using Multiple ADN8810 Devices for Additional Output Current ... 11 Timing Characteristics .. 4 Adding Dither to the Output Current ... 12 Absolute Maximum Ratings .. 5 Driving Common-Anode Laser Diodes ... 12 ESD Caution .. 5 PCB Layout Recommendations ... 13 Pin Configuration and Function Descriptions ... 6 Suggested Pad Layout for CP-24 Package ... 13 Typical Performance Characteristics ... 7 Outline Dimensions ... 14 Terminology .. 9 Ordering Guide .. 14 Functional Description .. 10
REVISION HISTORY 11/2017—Rev. B. to Rev. C 3/2016—Rev. A to Rev. B
Changed RS to RSN .. Throughout Changes to Figure 3 and Table 4 .. 7 Change to Figure 1 ... 1 Updated Outline Dimensions ... 15 Changes to Maximum Ful -Scale Output Current Parameter Changes to Ordering Guide .. 15 and Power Supply Rejection Ratio Parameter, Table 1 .. 3 Moved Timing Characteristics Section, Table 2, and Figure 2 ... 4
4/2009—Rev. 0 to Rev. A
Added Lead Temperature Range (Soldering 10 sec) Parameter, Changes to Table 3 ... 6 Table 3 .. 5 Changes to Figure 25 .. 14 Changes to Figure 3 and Table 4 ... 6 Updated Outline Dimensions ... 15 Changes to Setting Ful -Scale Output Current Section ... 10 Changes to Ordering Guide .. 15 Changes to Adding Dither to the Output Current Section, Figure 20, and Figure 21 .. 12
1/2004—Revision 0: Initial Version
Changes to PCB Layout Recommendations Section and Figure 25 .. 13 Updated to Outline Dimensions .. 14 Rev. C | Page 2 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY FUNCTIONAL DESCRIPTION SETTING FULL-SCALE OUTPUT CURRENT POWER SUPPLIES SERIAL DATA INTERFACE STANDBY AND RESET MODES POWER DISSIPATION USING MULTIPLE ADN8810 DEVICES FOR ADDITIONAL OUTPUT CURRENT ADDING DITHER TO THE OUTPUT CURRENT DRIVING COMMON-ANODE LASER DIODES PCB LAYOUT RECOMMENDATIONS SUGGESTED PAD LAYOUT FOR CP-24 PACKAGE OUTLINE DIMENSIONS ORDERING GUIDE