Datasheet MAX25601A, MAX25601B, MAX25601C, MAX25601D (Maxim) - 2

MAX25601A/MAX25601B/ Synchronous Boost and MAX25601C/MAX25601D Synchronous Buck LED Controllers
Absolute Maximum Ratings
IN, UVEN, INP, INN to AGND VDRV to PGND ..-0.3V to +6V (MAX25601A, MAX25601B) ..-0.3V to +40V PGND to AGND ..-0.3V to +0.3V IN, UVEN, INP, INN to AGND Continous Power Dissipation (Single-Layer Board), (MAX25601C, MAX25601D) ...-0.3V to +52V 32 pin SW TQFN T3255Y+6C LX1, TON to PGND ...-0.3V to +70V (TA = +70°C, derate 21.3mW/°C above +70°C.) ...1702mW LX2 to PGND..-1V to +70V Continuous Power Dissipation (Multilayer Board), BST_ to LX_ ..-0.3V to +6V 32 pin SW TQFN T3255Y+6C DH_ to LX_ ... -0.3V to VBST_ +0.3V (TA = +70°C, derate 34.5mW/°C above +70°C.) ...2759mW DL_, SHUNT_DRV to PGND ..-0.3V to VDRV+0.3V Continuous Power Dissipation (Single-Layer Board), CSP, CSN to PGND ..-2.5V to +6V 28 pin TSSOP U28E+1C CSP to CSN, INP to INN ..-0.3V to +0.3V (TA = +70°C, derate 22.2mW/°C above +70°C.) ...1777mW VCC to SGND ..-0.3V to VDRV+0.3V Continuous Power Dissipation (Multilayer Board), REFI, IOUTV, SYNCOUT to AGND...-0.3V to VDRV+0.3V 28 pin TSSOP U28E+1C (TA = +70°C, FB, OUT, COMP to AGND ..-0.3V to VDRV+0.3V derate 29.7mW/°C above +70°C.) ... mW to 2380mW FLT, SHUNT_CTRL, PWMDIM, Operating Temperature Range ..-40°C to 125°C RT/SYNCIN to AGND ..-0.3V to +6V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 32 pin TQFN
Package Code T3255Y+6C Outline Number
21-100041
Land Pattern Number
90-100066 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 47°C/W Junction to Case (θJC) 3°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 36°C/W Junction to Case (θJC) 3°C/W
28 pin TSSOP
Package Code U28E+1C Outline Number
21-100182
Land Pattern Number
90-100069 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 45°C/W Junction to Case (θJC) 2°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 33.6°C/W Junction to Case (θJC) 3.3°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
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