Datasheet BSP122 (Nexperia) - 5
| Hersteller | Nexperia |
| Beschreibung | N-channel enhancement mode vertical D-MOS transistor |
| Seiten / Seite | 9 / 5 — PACKAGE OUTLINE. Plastic surface mounted package; collector pad for good … |
| Revision | 17052001 |
| Dateiformat / Größe | PDF / 174 Kb |
| Dokumentensprache | Englisch |
PACKAGE OUTLINE. Plastic surface mounted package; collector pad for good heat transfer; 4 leads. SOT223
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Philips Semiconductors Product specification N-channel enhancement mode BSP122 vertical D-MOS transistor
PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223
D B E A X c y HE v M A b1
4
Q A A1
1 2 3
Lp e b w M 1 p B detail X e 0 2 4 mm scale
DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b c D E e e 1 1 HE Lp Q v w y
1.8 0.10 0.80 3.1 0.32 6.7 3.7 7.3 1.1 0.95 mm 4.6 2.3 0.2 0.1 0.1 1.5 0.01 0.60 2.9 0.22 6.3 3.3 6.7 0.7 0.85
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
97-02-28 SOT223 SC-73 99-09-13 2001 May 18 4 Document Outline FEATURES QUICK REFERENCE DATA DESCRIPTION PINNING - SOT223 LIMITING VALUES THERMAL CHARACTERISTICS CHARACTERISTICS PACKAGE OUTLINE SOT223 DATA SHEET STATUS DEFINITIONS DISCLAIMERS NOTES
PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223
D B E A X c y HE v M A b1
4
Q A A1
1 2 3
Lp e b w M 1 p B detail X e 0 2 4 mm scale
DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b c D E e e 1 1 HE Lp Q v w y
1.8 0.10 0.80 3.1 0.32 6.7 3.7 7.3 1.1 0.95 mm 4.6 2.3 0.2 0.1 0.1 1.5 0.01 0.60 2.9 0.22 6.3 3.3 6.7 0.7 0.85
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
97-02-28 SOT223 SC-73 99-09-13 2001 May 18 4 Document Outline FEATURES QUICK REFERENCE DATA DESCRIPTION PINNING - SOT223 LIMITING VALUES THERMAL CHARACTERISTICS CHARACTERISTICS PACKAGE OUTLINE SOT223 DATA SHEET STATUS DEFINITIONS DISCLAIMERS NOTES