Datasheet AD7416, AD7417, AD7418 (Analog Devices) - 7

HerstellerAnalog Devices
Beschreibung10-Bit Digital Temperature Sensor (AD7416) and 4-/1-Channel ADCs
Seiten / Seite23 / 7 — Data Sheet. AD7416/AD7417/AD7418. ABSOLUTE MAXIMUM RATINGS. Table 3. …
RevisionJ
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DokumentenspracheEnglisch

Data Sheet. AD7416/AD7417/AD7418. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter. Rating. REFIN. VDD. BAT81. AD7417. ESD CAUTION

Data Sheet AD7416/AD7417/AD7418 ABSOLUTE MAXIMUM RATINGS Table 3 Parameter Rating REFIN VDD BAT81 AD7417 ESD CAUTION

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Data Sheet AD7416/AD7417/AD7418 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
Table 3.
stress rating only; functional operation of the product at these
Parameter Rating
or any other conditions above those indicated in the operational VDD to AGND −0.3 V to +7 V section of this specification is not implied. Operation beyond VDD to DGND −0.3 V to +7 V the maximum operating conditions for extended periods may Analog Input Voltage to AGND affect product reliability. AIN1 to AIN4 −0.3 V to VDD + 0.3 V
REFIN VDD
Reference Input Voltage to AGND1 −0.3 V to VDD + 0.3 V Digital Input Voltage to DGND −0.3 V to VDD + 0.3 V
BAT81
Digital Output Voltage to DGND −0.3 V to VDD + 0.3 V Operating Temperature Range 025 A Version −40°C to +125°C 126-
AD7417
1 0 B Version −40°C to +85°C Figure 5. Diode Connection Storage Temperature Range −65°C to +150°C Junction Temperature 150°C TSSOP, Power Dissipation 450 mW
ESD CAUTION
θJA Thermal Impedance 120°C/W Lead Temperature, Soldering 260°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 16-Lead SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 100°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 8-Lead SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 157°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C MSOP Package, Power Dissipation 450 mW θJA Thermal Impedance 206°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 If the reference input voltage is likely to exceed VDD by more than 0.3 V (for example, during power-up) and the reference is capable of supplying 30 mA or more, it is recommended to use a clamping diode between the REFIN pin and the VDD pin. Figure 5 shows how the diode should be connected. Rev. J | Page 7 of 23 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS TABLE OF CONTENTS REVISION HISTORY PRODUCT HIGHLIGHTS SPECIFICATIONS AD7417/AD7418 SPECIFICATIONS AD7416 SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TERMINOLOGY THEORY OF OPERATION CIRCUIT INFORMATION CONVERTER DETAILS TYPICAL CONNECTION DIAGRAM ANALOG INPUTS ON-CHIP REFERENCE TEMPERATURE MEASUREMENT INTERNAL REGISTER STRUCTURE Address Pointer Register Temperature Value Register (Address 0x00) Configuration Register (Address 0x01) THYST Setpoint Register (Address 0x02) TOTI Setpoint Register (Address 0x03) ADC Value Register (Address 0x04) ADC Transfer Function Config2 Register (Address 0x05) SERIAL BUS INTERFACE Serial Bus Address Writing to the AD7416/AD7417/AD7418 Reading Data From the AD7416/AD7417/AD7418 OTI OUTPUT FAULT QUEUE POWER-ON DEFAULTS OPERATING MODES Mode 1 Mode 2 CONVSTB START MODE CONVSTB Pin Mode APPLICATIONS INFORMATION SUPPLY DECOUPLING POWER-ON RESET MOUNTING THE AD7416/AD7417/AD7418 FAN CONTROLLER THERMOSTAT SYSTEM WITH MULTIPLE AD7416 DEVICES OUTLINE DIMENSIONS ORDERING GUIDE