Datasheet ADT7316, ADT7317, ADT7318 (Analog Devices) - 10

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ADT7316/ADT7317/ADT7318 ABSOLUTE MAXIMUM RATINGS Table 3.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
Parameter Rating
rating only; functional operation of the device at these or any VDD to GND −0.3 V to +7 V other conditions above those indicated in the operational Digital Input Voltage to GND −0.3 V to VDD + 0.3 V section of this specification is not implied. Exposure to absolute Digital Output Voltage to GND −0.3 V to VDD + 0.3 V maximum rating conditions for extended periods may affect Reference Input Voltage to GND −0.3 V to VDD + 0.3 V device reliability. Operating Temperature Range −40°C to +120°C Storage Temperature Range −65°C to +150°C Junction Temperature
Table 4. I2C Address Selection
16-Lead QSOP 150°C
ADD Pin I2C Address
Power Dissipation1 (TJ max − TA)/θJA Low 1001 000 Thermal Impedance2 Float 1001 010 θJA Junction-to-Ambient 105.44°C/W High 1001 011 θJC Junction-to-Case 38.8°C/W IR Reflow Soldering Peak Temperature 220°C (0/5°C)
ESD CAUTION
Time at Peak Temperature 10 sec to 20 sec Ramp-Up Rate 2°C/sec to 3°C/sec Ramp-Down Rate −6°C/sec IR Reflow Soldering (Pb-Free Package) Peak Temperature 260°C (+ 0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec maximum Ramp-Down Rate –6°C/sec maximum Time 25°C to Peak Temperature 8 minutes maximum 1 Values relate to package being used on a 4-layer board. 2 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled, PCB- mounted components. Rev. B | Page 10 of 44 Document Outline FEATURES APPLICATIONS PIN CONFIGURATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS FUNCTIONAL BLOCK DIAGRAM DAC AC CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION POWER-UP CALIBRATION CONVERSION SPEED FUNCTIONAL DESCRIPTION—VOLTAGE OUTPUT DIGITAL-TO-ANALOG CONVERTERS DIGITAL-TO-ANALOG SECTION RESISTOR STRING DAC EXTERNAL REFERENCE INPUTS OUTPUT AMPLIFIER THERMAL VOLTAGE OUTPUT Negative Temperatures Positive Temperatures FUNCTIONAL DESCRIPTION—MEASUREMENT TEMPERATURE SENSOR VDD MONITORING ON-CHIP REFERENCE ROUND ROBIN MEASUREMENT SINGLE-CHANNEL MEASUREMENT TEMPERATURE MEASUREMENT METHOD Internal Temperature Measurement External Temperature Measurement TEMPERATURE VALUE FORMAT Temperature Conversion Formula INTERRUPTS REGISTERS REGISTER DESCRIPTIONS SERIAL INTERFACE SERIAL INTERFACE SELECTION I2C SERIAL INTERFACE Writing to the ADT7316/ADT7317/ADT7318 Writing to the Address Pointer Register for a Subsequent Read Writing Data to a Register Reading Data from the ADT7316/ADT7317/ADT7318 SPI SERIAL INTERFACE Write Operation Read Operation SMBUS/SPI INT/ SMBUS Alert Response LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE